AMD EPYC 9684X vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 9684X and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 9684X

  • 70 more cores, run more applications at once: 96 vs 26
  • 140 more threads: 192 vs 52
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Number of cores 96 vs 26
Number of threads 192 vs 52
Manufacturing process technology 5 nm vs 14 nm

Reasons to consider the Intel Xeon Platinum 8170

  • 2.4x lower typical power consumption: 165 Watt vs 400 Watt
Thermal Design Power (TDP) 165 Watt vs 400 Watt

Compare benchmarks

CPU 1: AMD EPYC 9684X
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 9684X Intel Xeon Platinum 8170
PassMark - Single thread mark 2881
PassMark - CPU mark 157672
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 9684X Intel Xeon Platinum 8170

Essentials

Launch date 13 Jun 2023 Q3'17
Launch price (MSRP) $14756
Place in performance rating 6 2
Architecture codename Skylake
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched
Vertical segment Server

Performance

Base frequency 2.55 GHz 2.10 GHz
Die size 12x 72 mm²
L1 cache 64 KB (per core)
L2 cache 1 MB (per core)
L3 cache 1152 MB (shared)
Manufacturing process technology 5 nm 14 nm
Maximum frequency 3.7 GHz 3.70 GHz
Number of cores 96 26
Number of threads 192 52
Transistor count 135,240 million
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Supported memory types DDR5 DDR4-2666
Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz

Compatibility

Configurable TDP 320-400 Watt
Max number of CPUs in a configuration 2
Sockets supported SP5 FCLGA3647
Thermal Design Power (TDP) 400 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 128 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)