AMD EPYC Embedded 9354 vs Intel Core i7-3960X
Comparative analysis of AMD EPYC Embedded 9354 and Intel Core i7-3960X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD EPYC Embedded 9354
- CPU is newer: launch date 11 year(s) 4 month(s) later
- 26 more cores, run more applications at once: 32 vs 6
- 52 more threads: 64 vs 12
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 32 nm
- 5.3x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date | 14 Mar 2023 vs November 2011 |
Number of cores | 32 vs 6 |
Number of threads | 64 vs 12 |
Manufacturing process technology | 5 nm vs 32 nm |
L1 cache | 64K (per core) vs 64 KB (per core) |
Max number of CPUs in a configuration | 2 vs 1 |
Reasons to consider the Intel Core i7-3960X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 3% higher clock speed: 3.90 GHz vs 3.8 GHz
- 49152x more L2 cache, more data can be stored in the L2 cache for quick access later
- 61440x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.2x lower typical power consumption: 130 Watt vs 280 Watt
Unlocked | Unlocked vs Locked |
Maximum frequency | 3.90 GHz vs 3.8 GHz |
L2 cache | 256 KB (per core) vs 1MB (per core) |
L3 cache | 15360 KB (shared) vs 256MB (shared) |
Thermal Design Power (TDP) | 130 Watt vs 280 Watt |
Compare benchmarks
CPU 1: AMD EPYC Embedded 9354
CPU 2: Intel Core i7-3960X
Name | AMD EPYC Embedded 9354 | Intel Core i7-3960X |
---|---|---|
PassMark - Single thread mark | 1788 | |
PassMark - CPU mark | 8425 | |
Geekbench 4 - Single Core | 821 | |
Geekbench 4 - Multi-Core | 4933 | |
3DMark Fire Strike - Physics Score | 5484 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 6.358 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 27.376 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.727 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.924 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 7.797 |
Compare specifications (specs)
AMD EPYC Embedded 9354 | Intel Core i7-3960X | |
---|---|---|
Essentials |
||
Launch date | 14 Mar 2023 | November 2011 |
Place in performance rating | not rated | 2068 |
Architecture codename | Sandy Bridge E | |
Launch price (MSRP) | $861 | |
Price now | $799.99 | |
Processor Number | i7-3960X | |
Series | Intel® Core™ X-series Processors | |
Status | Discontinued | |
Value for money (0-100) | 4.64 | |
Vertical segment | Desktop | |
Performance |
||
Base frequency | 3.25 GHz | 3.30 GHz |
Die size | 8x 72 mm² | 435 mm |
L1 cache | 64K (per core) | 64 KB (per core) |
L2 cache | 1MB (per core) | 256 KB (per core) |
L3 cache | 256MB (shared) | 15360 KB (shared) |
Manufacturing process technology | 5 nm | 32 nm |
Maximum frequency | 3.8 GHz | 3.90 GHz |
Number of cores | 32 | 6 |
Number of threads | 64 | 12 |
Transistor count | 52,560 million | 2270 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Maximum case temperature (TCase) | 67 °C | |
Maximum core temperature | 66.8°C | |
VID voltage range | 0.6V-1.35V | |
Memory |
||
ECC memory support | ||
Supported memory types | DDR5-4800 MHz, Twelve-channel | DDR3 1066/1333/1600 |
Max memory channels | 4 | |
Maximum memory bandwidth | 51.2 GB/s | |
Maximum memory size | 64 GB | |
Compatibility |
||
Configurable TDP | 240-300 Watt | |
Max number of CPUs in a configuration | 2 | 1 |
Sockets supported | SP5 | FCLGA2011 |
Thermal Design Power (TDP) | 280 Watt | 130 Watt |
Low Halogen Options Available | ||
Package Size | 52.5mm x 45.0mm | |
Peripherals |
||
PCIe configurations | Gen 5, 128 Lanes, (CPU only) | |
Max number of PCIe lanes | 40 | |
PCI Express revision | 2.0 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |