AMD EPYC Embedded 9354 vs Intel Xeon w7-2475X

Comparative analysis of AMD EPYC Embedded 9354 and Intel Xeon w7-2475X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC Embedded 9354

Intel Xeon w7-2475X

Differences

Reasons to consider the AMD EPYC Embedded 9354

12 more cores, run more applications at once: 32 vs 20
24 more threads: 64 vs 40
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 10 nm
Around 28% more L1 cache; more data can be stored in the L1 cache for quick access later
6.9x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	32 vs 20
Number of threads	64 vs 40
Manufacturing process technology	5 nm vs 10 nm
L1 cache	64K (per core) vs 80K (per core)
L3 cache	256MB (shared) vs 37.5MB
Max number of CPUs in a configuration	2 vs 1

Reasons to consider the Intel Xeon w7-2475X

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 26% higher clock speed: 4.8 GHz vs 3.8 GHz
Around 25% more L2 cache; more data can be stored in the L2 cache for quick access later
Around 24% lower typical power consumption: 225 Watt vs 280 Watt

Unlocked	Unlocked vs Locked
Maximum frequency	4.8 GHz vs 3.8 GHz
L2 cache	2MB (per core) vs 1MB (per core)
Thermal Design Power (TDP)	225 Watt vs 280 Watt

Compare benchmarks

CPU 1: AMD EPYC Embedded 9354
CPU 2: Intel Xeon w7-2475X

Name	AMD EPYC Embedded 9354	Intel Xeon w7-2475X
PassMark - Single thread mark		3714
PassMark - CPU mark		55249

Compare specifications (specs)

	AMD EPYC Embedded 9354	Intel Xeon w7-2475X
Essentials
Launch date	14 Mar 2023	15 Feb 2023
Place in performance rating	not rated	96
Launch price (MSRP)		$1789
Performance
Base frequency	3.25 GHz	2.6 GHz
Die size	8x 72 mm²
L1 cache	64K (per core)	80K (per core)
L2 cache	1MB (per core)	2MB (per core)
L3 cache	256MB (shared)	37.5MB
Manufacturing process technology	5 nm	10 nm
Maximum frequency	3.8 GHz	4.8 GHz
Number of cores	32	20
Number of threads	64	40
Transistor count	52,560 million
Unlocked
Maximum case temperature (TCase)		76°C
Memory
ECC memory support
Supported memory types	DDR5-4800 MHz, Twelve-channel	DDR5-4800 MHz, Quad-channel
Compatibility
Configurable TDP	240-300 Watt
Max number of CPUs in a configuration	2	1
Sockets supported	SP5	4677
Thermal Design Power (TDP)	280 Watt	225 Watt
Peripherals
PCIe configurations	Gen 5, 128 Lanes, (CPU only)	Gen 5, 64 Lanes, (CPU only)