AMD GX-420MC vs Intel Core 2 Duo T5470
Comparative analysis of AMD GX-420MC and Intel Core 2 Duo T5470 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics API support, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD GX-420MC
- 2 more cores, run more applications at once: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 65 nm
- Around 94% lower typical power consumption: 17.5 Watt vs 35 Watt
- Around 9% better performance in PassMark - Single thread mark: 695 vs 636
- 3x better performance in PassMark - CPU mark: 1796 vs 590
Specifications (specs) | |
Number of cores | 4 vs 2 |
Manufacturing process technology | 28 nm vs 65 nm |
Thermal Design Power (TDP) | 17.5 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 695 vs 636 |
PassMark - CPU mark | 1796 vs 590 |
Compare benchmarks
CPU 1: AMD GX-420MC
CPU 2: Intel Core 2 Duo T5470
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD GX-420MC | Intel Core 2 Duo T5470 |
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PassMark - Single thread mark | 695 | 636 |
PassMark - CPU mark | 1796 | 590 |
Geekbench 4 - Single Core | 1096 | |
Geekbench 4 - Multi-Core | 1671 |
Compare specifications (specs)
AMD GX-420MC | Intel Core 2 Duo T5470 | |
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Essentials |
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Architecture codename | Puma | Merom |
Launch date | 6 Jun 2014 | |
Place in performance rating | 2647 | 2403 |
Vertical segment | Embedded | Mobile |
Processor Number | T5470 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Performance |
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Base frequency | 2.0 GHz | 1.60 GHz |
L1 cache | 256 KB | |
L2 cache | 2 MB | |
Manufacturing process technology | 28 nm | 65 nm |
Maximum frequency | 2.0 GHz | |
Number of cores | 4 | 2 |
Number of threads | 4 | |
64 bit support | ||
Bus Speed | 800 MHz FSB | |
Die size | 143 mm2 | |
Maximum core temperature | 100°C | |
Transistor count | 291 million | |
VID voltage range | 1.075V-1.250V | |
Memory |
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ECC memory support | ||
Max memory channels | 1 | |
Supported memory types | DDR3-1600 | |
Graphics API support |
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DirectX | 11.2 | |
OpenGL | 4.3 | |
Compatibility |
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Sockets supported | FT3b | PPGA478 |
Thermal Design Power (TDP) | 17.5 Watt | 35 Watt |
Low Halogen Options Available | ||
Package Size | 35mm x 35mm | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |