AMD Mobile Sempron 210U vs AMD Turion 64 ML-30

Comparative analysis of AMD Mobile Sempron 210U and AMD Turion 64 ML-30 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Mobile Sempron 210U

AMD Turion 64 ML-30

Differences

Reasons to consider the AMD Mobile Sempron 210U

CPU is newer: launch date 3 year(s) 10 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
2.3x lower typical power consumption: 15 Watt vs 35 Watt

Launch date	16 January 2009 vs March 2005
Manufacturing process technology	65 nm vs 90 nm
Thermal Design Power (TDP)	15 Watt vs 35 Watt

Reasons to consider the AMD Turion 64 ML-30

Around 7% higher clock speed: 1.6 GHz vs 1.5 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 5% better performance in PassMark - Single thread mark: 314 vs 299
Around 4% better performance in PassMark - CPU mark: 277 vs 267

Specifications (specs)
Maximum frequency	1.6 GHz vs 1.5 GHz
L2 cache	1024 KB vs 256 KB
Benchmarks
PassMark - Single thread mark	314 vs 299
PassMark - CPU mark	277 vs 267

Compare benchmarks

CPU 1: AMD Mobile Sempron 210U
CPU 2: AMD Turion 64 ML-30

PassMark - Single thread mark

CPU 1

CPU 2

299

314

PassMark - CPU mark

CPU 1

CPU 2

267

277

Name	AMD Mobile Sempron 210U	AMD Turion 64 ML-30
PassMark - Single thread mark	299	314
PassMark - CPU mark	267	277

Compare specifications (specs)

	AMD Mobile Sempron 210U	AMD Turion 64 ML-30
Essentials
Launch date	16 January 2009	March 2005
Place in performance rating	3239	3230
Series	AMD Mobile Sempron	Turion 64
Vertical segment	Laptop	Laptop
Architecture codename		Lancaster
Performance
64 bit support
Front-side bus (FSB)	1600 MHz	800 MHz
L1 cache	128 KB	128 KB
L2 cache	256 KB	1024 KB
Manufacturing process technology	65 nm	90 nm
Maximum frequency	1.5 GHz	1.6 GHz
Number of cores	1	1
Number of threads	1	1
Die size		125 mm
Transistor count		114 million
Compatibility
Sockets supported	812-ball BGA	754
Thermal Design Power (TDP)	15 Watt	35 Watt
Max number of CPUs in a configuration		1
Advanced Technologies
PowerNow