AMD Opteron 4376 HE vs Intel Celeron D 330
Comparative analysis of AMD Opteron 4376 HE and Intel Celeron D 330 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability.
Differences
Reasons to consider the AMD Opteron 4376 HE
- 7 more cores, run more applications at once: 8 vs 1
- Around 35% higher clock speed: 3.6 GHz vs 2.66 GHz
- Around 1% higher maximum core temperature: 68°C vs 67°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
- 24x more L1 cache, more data can be stored in the L1 cache for quick access later
- 32x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% lower typical power consumption: 65 Watt vs 73 Watt
| Number of cores | 8 vs 1 |
| Maximum frequency | 3.6 GHz vs 2.66 GHz |
| Maximum core temperature | 68°C vs 67°C |
| Manufacturing process technology | 32 nm vs 90 nm |
| L1 cache | 384 KB vs 16 KB |
| L2 cache | 8 MB vs 256 KB |
| Max number of CPUs in a configuration | 2 vs 1 |
| Thermal Design Power (TDP) | 65 Watt vs 73 Watt |
Compare specifications (specs)
| AMD Opteron 4376 HE | Intel Celeron D 330 | |
|---|---|---|
Essentials |
||
| Architecture codename | Seoul | Prescott |
| Family | AMD Opteron | |
| Launch date | n/d | June 2004 |
| OPN Tray | OS4376OFU8KHK | |
| Place in performance rating | not rated | not rated |
| Series | AMD Opteron 4300 Series Processor | Legacy Intel® Celeron® Processor |
| Vertical segment | Server | Desktop |
| Processor Number | 330 | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.6 GHz | 2.66 GHz |
| Die size | 315 mm | 112 mm2 |
| L1 cache | 384 KB | 16 KB |
| L2 cache | 8 MB | 256 KB |
| L3 cache | 8 MB | |
| Manufacturing process technology | 32 nm | 90 nm |
| Maximum core temperature | 68°C | 67°C |
| Maximum frequency | 3.6 GHz | 2.66 GHz |
| Number of cores | 8 | 1 |
| Number of threads | 8 | |
| Transistor count | 1200 million | 125 million |
| Unlocked | ||
| Bus Speed | 533 MHz FSB | |
| VID voltage range | 1.250V-1.400V | |
Memory |
||
| Supported memory frequency | 2000 MHz | |
| Supported memory types | DDR3 | DDR1, DDR2, DDR3 |
Compatibility |
||
| Max number of CPUs in a configuration | 2 | 1 |
| Sockets supported | C32 | PPGA478 |
| Thermal Design Power (TDP) | 65 Watt | 73 Watt |
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | |
Advanced Technologies |
||
| Fused Multiply-Add (FMA) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
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