AMD Phenom II X4 955 (125W) vs Intel Celeron 2.10
Comparative analysis of AMD Phenom II X4 955 (125W) and Intel Celeron 2.10 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Phenom II X4 955 (125W)
- CPU is newer: launch date 6 year(s) 5 month(s) later
- 3 more cores, run more applications at once: 4 vs 1
- Around 52% higher clock speed: 3.2 GHz vs 2.1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
- 64x more L1 cache, more data can be stored in the L1 cache for quick access later
- 16x more L2 cache, more data can be stored in the L2 cache for quick access later
| Launch date | April 2009 vs November 2002 |
| Number of cores | 4 vs 1 |
| Maximum frequency | 3.2 GHz vs 2.1 GHz |
| Manufacturing process technology | 45 nm vs 130 nm |
| L1 cache | 128 KB (per core) vs 8 KB |
| L2 cache | 512 KB (per core) vs 128 KB |
Reasons to consider the Intel Celeron 2.10
- 2.2x lower typical power consumption: 55.5 Watt vs 125 Watt
| Thermal Design Power (TDP) | 55.5 Watt vs 125 Watt |
Compare benchmarks
CPU 1: AMD Phenom II X4 955 (125W)
CPU 2: Intel Celeron 2.10
| Name | AMD Phenom II X4 955 (125W) | Intel Celeron 2.10 |
|---|---|---|
| 3DMark Fire Strike - Physics Score | 0 | |
| PassMark - Single thread mark | 0 | |
| PassMark - CPU mark | 244 |
Compare specifications (specs)
| AMD Phenom II X4 955 (125W) | Intel Celeron 2.10 | |
|---|---|---|
Essentials |
||
| Architecture codename | Deneb | Northwood |
| Launch date | April 2009 | November 2002 |
| Place in performance rating | 3360 | 3348 |
| Vertical segment | Desktop | Desktop |
| Series | Legacy Intel® Celeron® Processor | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Die size | 258 mm | 131 mm2 |
| L1 cache | 128 KB (per core) | 8 KB |
| L2 cache | 512 KB (per core) | 128 KB |
| L3 cache | 6144 KB (shared) | |
| Manufacturing process technology | 45 nm | 130 nm |
| Maximum frequency | 3.2 GHz | 2.1 GHz |
| Number of cores | 4 | 1 |
| Transistor count | 758 million | 55 million |
| Base frequency | 2.10 GHz | |
| Bus Speed | 400 MHz FSB | |
| Maximum core temperature | 69°C | |
| VID voltage range | 1.315V-1.525V | |
Memory |
||
| Supported memory types | DDR3 | DDR1, DDR2 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM3 | PPGA478 |
| Thermal Design Power (TDP) | 125 Watt | 55.5 Watt |
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
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