AMD Phenom II X4 955 (125W) vs Intel Pentium III 1000
Comparative analysis of AMD Phenom II X4 955 (125W) and Intel Pentium III 1000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Phenom II X4 955 (125W)
- 3 more cores, run more applications at once: 4 vs 1
- Around 220% higher clock speed: 3.2 GHz vs 1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 180 nm
- 64x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
| Number of cores | 4 vs 1 |
| Maximum frequency | 3.2 GHz vs 1 GHz |
| Manufacturing process technology | 45 nm vs 180 nm |
| L1 cache | 128 KB (per core) vs 8 KB |
| L2 cache | 512 KB (per core) vs 256 KB |
Reasons to consider the Intel Pentium III 1000
- 4.3x lower typical power consumption: 29 Watt vs 125 Watt
| Thermal Design Power (TDP) | 29 Watt vs 125 Watt |
Compare benchmarks
CPU 1: AMD Phenom II X4 955 (125W)
CPU 2: Intel Pentium III 1000
| Name | AMD Phenom II X4 955 (125W) | Intel Pentium III 1000 |
|---|---|---|
| 3DMark Fire Strike - Physics Score | 0 | |
| PassMark - Single thread mark | 0 | |
| PassMark - CPU mark | 245 |
Compare specifications (specs)
| AMD Phenom II X4 955 (125W) | Intel Pentium III 1000 | |
|---|---|---|
Essentials |
||
| Architecture codename | Deneb | Coppermine |
| Launch date | April 2009 | Q1'00 |
| Place in performance rating | 3360 | 3352 |
| Vertical segment | Desktop | Desktop |
| Series | Legacy Intel® Pentium® Processor | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Die size | 258 mm | 80 mm |
| L1 cache | 128 KB (per core) | 8 KB |
| L2 cache | 512 KB (per core) | 256 KB |
| L3 cache | 6144 KB (shared) | |
| Manufacturing process technology | 45 nm | 180 nm |
| Maximum frequency | 3.2 GHz | 1 GHz |
| Number of cores | 4 | 1 |
| Transistor count | 758 million | 44 million |
| Base frequency | 1.00 GHz | |
| Bus Speed | 133 MHz FSB | |
| Maximum case temperature (TCase) | 69 °C | |
| Maximum core temperature | 75°C | |
| VID voltage range | 1.75V | |
Memory |
||
| Supported memory types | DDR3 | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM3 | PPGA370, SECC2, SECC2495 |
| Thermal Design Power (TDP) | 125 Watt | 29 Watt |
| Low Halogen Options Available | ||
Advanced Technologies |
||
| Intel® Turbo Boost technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
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