AMD Phenom X3 8750 vs Intel Pentium M 745

Comparative analysis of AMD Phenom X3 8750 and Intel Pentium M 745 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Virtualization, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Phenom X3 8750

Intel Pentium M 745

Differences

Reasons to consider the AMD Phenom X3 8750

CPU is newer: launch date 3 year(s) 11 month(s) later
2 more cores, run more applications at once: 3 vs 1
Around 33% higher clock speed: 2.4 GHz vs 1.8 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
12x more L1 cache, more data can be stored in the L1 cache for quick access later

Launch date	April 2008 vs May 2004
Number of cores	3 vs 1
Maximum frequency	2.4 GHz vs 1.8 GHz
Manufacturing process technology	65 nm vs 90 nm
L1 cache	128 KB (per core) vs 32 KB

Reasons to consider the Intel Pentium M 745

Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
11.9x lower typical power consumption: 7.5 Watt vs 95 Watt

L2 cache	2048 KB vs 512 KB (per core)
Thermal Design Power (TDP)	7.5 Watt vs 95 Watt

Compare benchmarks

CPU 1: AMD Phenom X3 8750
CPU 2: Intel Pentium M 745

Name	AMD Phenom X3 8750	Intel Pentium M 745
Geekbench 4 - Single Core	293
Geekbench 4 - Multi-Core	790

Compare specifications (specs)

	AMD Phenom X3 8750	Intel Pentium M 745
Essentials
Architecture codename	Toliman	Dothan
Launch date	April 2008	May 2004
Place in performance rating	3205	not rated
Vertical segment	Desktop	Mobile
Processor Number		745
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	285 mm	87 mm2
L1 cache	128 KB (per core)	32 KB
L2 cache	512 KB (per core)	2048 KB
L3 cache	2048 KB (shared)
Manufacturing process technology	65 nm	90 nm
Maximum frequency	2.4 GHz	1.8 GHz
Number of cores	3	1
Transistor count	450 million	144 million
Base frequency		1.80 GHz
Bus Speed		400 MHz FSB
Front-side bus (FSB)		400 MHz
Maximum core temperature		100°C
Number of threads		1
VID voltage range		1.276V-1.34V
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM2+	PPGA478, H-PBGA479
Thermal Design Power (TDP)	95 Watt	7.5 Watt
Low Halogen Options Available
Package Size		35mm x 35mm
Scenario Design Power (SDP)		0 W
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology