AMD Ryzen 3 3200G vs Intel Core i7-3770
Comparative analysis of AMD Ryzen 3 3200G and Intel Core i7-3770 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 3 3200G
- CPU is newer: launch date 7 year(s) 3 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 3% higher clock speed: 4 GHz vs 3.90 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 22 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 18% lower typical power consumption: 65 Watt vs 77 Watt
- Around 11% better performance in Geekbench 4 - Single Core: 886 vs 798
- Around 6% better performance in PassMark - Single thread mark: 2195 vs 2074
- Around 10% better performance in PassMark - CPU mark: 7071 vs 6416
Specifications (specs) | |
Launch date | 7 July 2019 vs April 2012 |
Unlocked | Unlocked vs Locked |
Maximum frequency | 4 GHz vs 3.90 GHz |
Manufacturing process technology | 12 nm vs 22 nm |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 2 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 65 Watt vs 77 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 886 vs 798 |
PassMark - Single thread mark | 2195 vs 2074 |
PassMark - CPU mark | 7071 vs 6416 |
Reasons to consider the Intel Core i7-3770
- 4 more threads: 8 vs 4
- Around 11% higher maximum core temperature: 105°C vs 95 °C
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 6% better performance in Geekbench 4 - Multi-Core: 3074 vs 2901
- Around 2% better performance in 3DMark Fire Strike - Physics Score: 1977 vs 1933
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum core temperature | 105°C vs 95 °C |
L3 cache | 8192 KB (shared) vs 4 MB |
Benchmarks | |
Geekbench 4 - Multi-Core | 3074 vs 2901 |
3DMark Fire Strike - Physics Score | 1977 vs 1933 |
Compare benchmarks
CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Core i7-3770
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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PassMark - Single thread mark |
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PassMark - CPU mark |
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3DMark Fire Strike - Physics Score |
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Name | AMD Ryzen 3 3200G | Intel Core i7-3770 |
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Geekbench 4 - Single Core | 886 | 798 |
Geekbench 4 - Multi-Core | 2901 | 3074 |
PassMark - Single thread mark | 2195 | 2074 |
PassMark - CPU mark | 7071 | 6416 |
3DMark Fire Strike - Physics Score | 1933 | 1977 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.673 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 81.095 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.589 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.318 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.05 | |
GFXBench 4.0 - T-Rex (Frames) | 2876 | |
GFXBench 4.0 - T-Rex (Fps) | 2876 |
Compare specifications (specs)
AMD Ryzen 3 3200G | Intel Core i7-3770 | |
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Essentials |
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Family | Ryzen | |
Launch date | 7 July 2019 | April 2012 |
OPN PIB | YD3200C5FHBOX | |
OPN Tray | YD3200C5M4MFH | |
Place in performance rating | 1693 | 2019 |
Series | Ryzen 3 | Legacy Intel® Core™ Processors |
Vertical segment | Desktop | Desktop |
Architecture codename | Ivy Bridge | |
Launch price (MSRP) | $324 | |
Price now | $159.99 | |
Processor Number | i7-3770 | |
Status | Discontinued | |
Value for money (0-100) | 17.10 | |
Performance |
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64 bit support | ||
Base frequency | 3.6 GHz | 3.40 GHz |
L1 cache | 384 KB | 64 KB (per core) |
L2 cache | 2 MB | 256 KB (per core) |
L3 cache | 4 MB | 8192 KB (shared) |
Manufacturing process technology | 12 nm | 22 nm |
Maximum core temperature | 95 °C | 105°C |
Maximum frequency | 4 GHz | 3.90 GHz |
Number of cores | 4 | 4 |
Number of GPU cores | 8 | |
Number of threads | 4 | 8 |
Unlocked | ||
Bus Speed | 5 GT/s DMI | |
Die size | 160 mm | |
Maximum case temperature (TCase) | 67 °C | |
Transistor count | 1400 million | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory frequency | 2933 MHz | |
Supported memory types | DDR4-2933 | DDR3 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Graphics |
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Graphics base frequency | 1250 MHz | 650 MHz |
iGPU core count | 8 | |
Processor graphics | Radeon Vega 8 Graphics | Intel® HD Graphics 4000 |
Device ID | 0x162 | |
Graphics max dynamic frequency | 1.15 GHz | |
Graphics max frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Configurable TDP | 45-65 Watt | |
Sockets supported | AM4 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 77 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | 2011D | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x8 | up to 1x16, 2x8, 1x8 & 2x4 |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |