AMD Ryzen 3 4300GE vs Intel Core 2 Extreme QX9770

Comparative analysis of AMD Ryzen 3 4300GE and Intel Core 2 Extreme QX9770 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Ryzen 3 4300GE

Intel Core 2 Extreme QX9770

Differences

Reasons to consider the AMD Ryzen 3 4300GE

CPU is newer: launch date 12 year(s) 4 month(s) later
Around 25% higher clock speed: 4.0 GHz vs 3.2 GHz
Around 71% higher maximum core temperature: 95 °C vs 55.5°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 45 nm
3.9x lower typical power consumption: 35 Watt vs 136 Watt

Launch date	21 Jul 2020 vs March 2008
Maximum frequency	4.0 GHz vs 3.2 GHz
Maximum core temperature	95 °C vs 55.5°C
Manufacturing process technology	7 nm vs 45 nm
Thermal Design Power (TDP)	35 Watt vs 136 Watt

Reasons to consider the Intel Core 2 Extreme QX9770

6x more L2 cache, more data can be stored in the L2 cache for quick access later

L2 cache	12288 KB vs 2 MB

Compare benchmarks

CPU 1: AMD Ryzen 3 4300GE
CPU 2: Intel Core 2 Extreme QX9770

Name	AMD Ryzen 3 4300GE	Intel Core 2 Extreme QX9770
PassMark - Single thread mark	2550
PassMark - CPU mark	11253
Geekbench 4 - Single Core		2338
Geekbench 4 - Multi-Core		6682

Compare specifications (specs)

	AMD Ryzen 3 4300GE	Intel Core 2 Extreme QX9770
Essentials
Architecture codename	Zen 2	Yorkfield
Launch date	21 Jul 2020	March 2008
OPN Tray	100-000000151
Place in performance rating	891	837
Vertical segment	Desktop	Desktop
Processor Number		QX9770
Series		Legacy Intel® Core™ Processors
Status		Discontinued
Performance
Base frequency	3.5 GHz	3.20 GHz
L1 cache	256 KB	256 KB
L2 cache	2 MB	12288 KB
L3 cache	4 MB
Manufacturing process technology	7 nm	45 nm
Maximum core temperature	95 °C	55.5°C
Maximum frequency	4.0 GHz	3.2 GHz
Number of cores	4	4
Number of GPU cores	6
Number of threads	8
Unlocked
64 bit support
Bus Speed		1600 MHz FSB
Die size		214 mm2
Maximum case temperature (TCase)		55 °C
Transistor count		820 million
VID voltage range		0.8500V-1.3625V
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	43.71 GB/s
Maximum memory size	64 GB
Supported memory types	DDR4-3200	DDR1, DDR2, DDR3
Graphics
Graphics base frequency	1700 MHz
iGPU core count	6
Processor graphics	Radeon Vega 6
Graphics interfaces
DisplayPort
HDMI
Compatibility
Sockets supported	AM4	LGA775
Thermal Design Power (TDP)	35 Watt	136 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Peripherals
PCI Express revision	3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)