AMD Ryzen 7 PRO 7745 vs AMD EPYC 72F3
Comparative analysis of AMD Ryzen 7 PRO 7745 and AMD EPYC 72F3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 7 PRO 7745
- CPU is newer: launch date 2 year(s) 2 month(s) later
- Around 29% higher clock speed: 5.3 GHz vs 4.1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm
- 2.8x lower typical power consumption: 65 Watt vs 180 Watt
- Around 22% better performance in PassMark - Single thread mark: 3702 vs 3034
Specifications (specs) | |
Launch date | 13 Jun 2023 vs 15 Mar 2021 |
Maximum frequency | 5.3 GHz vs 4.1 GHz |
Manufacturing process technology | 5 nm vs 7 nm |
Thermal Design Power (TDP) | 65 Watt vs 180 Watt |
Benchmarks | |
PassMark - Single thread mark | 3702 vs 3034 |
Reasons to consider the AMD EPYC 72F3
- 524288x more L2 cache, more data can be stored in the L2 cache for quick access later
- 8388608x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 79% better performance in PassMark - CPU mark: 50017 vs 28019
Specifications (specs) | |
L2 cache | 4 MB vs 1MB (per core) |
L3 cache | 256 MB vs 32MB (shared) |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
PassMark - CPU mark | 50017 vs 28019 |
Compare benchmarks
CPU 1: AMD Ryzen 7 PRO 7745
CPU 2: AMD EPYC 72F3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 PRO 7745 | AMD EPYC 72F3 |
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PassMark - Single thread mark | 3702 | 3034 |
PassMark - CPU mark | 28019 | 50017 |
Compare specifications (specs)
AMD Ryzen 7 PRO 7745 | AMD EPYC 72F3 | |
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Essentials |
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Launch date | 13 Jun 2023 | 15 Mar 2021 |
Place in performance rating | 230 | 229 |
Architecture codename | Milan | |
Launch price (MSRP) | $2468 | |
Performance |
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Base frequency | 3.8 GHz | 3.7 GHz |
Die size | 71 mm² | 81 mm² |
L1 cache | 64K (per core) | 512 KB |
L2 cache | 1MB (per core) | 4 MB |
L3 cache | 32MB (shared) | 256 MB |
Manufacturing process technology | 5 nm | 7 nm |
Maximum case temperature (TCase) | 61°C | |
Maximum core temperature | 95°C | |
Maximum frequency | 5.3 GHz | 4.1 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Transistor count | 6,570 million | 33200 million |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5-5200 MHz, Dual-channel | DDR4 |
Max memory channels | 8 | |
Supported memory frequency | 3200 MHz | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | AM5 | SP3 |
Thermal Design Power (TDP) | 65 Watt | 180 Watt |
Configurable TDP | 165-200 Watt | |
Peripherals |
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PCIe configurations | Gen 5, 24 Lanes, (CPU only) | |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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AMD Virtualization (AMD-V™) |