AMD Ryzen 7 PRO 8845HS vs AMD EPYC 4364P

Comparative analysis of AMD Ryzen 7 PRO 8845HS and AMD EPYC 4364P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 7 PRO 8845HS

AMD EPYC 4364P

Differences

Reasons to consider the AMD Ryzen 7 PRO 8845HS

Around 5% higher maximum core temperature: 100°C vs 95°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
2.3x lower typical power consumption: 45 Watt vs 105 Watt
Around 5% better performance in PassMark - Single thread mark: 3828 vs 3661

Specifications (specs)
Maximum core temperature	100°C vs 95°C
Manufacturing process technology	4 nm vs 5 nm
Thermal Design Power (TDP)	45 Watt vs 105 Watt
Benchmarks
PassMark - Single thread mark	3828 vs 3661

Reasons to consider the AMD EPYC 4364P

CPU is newer: launch date 1 month(s) later
Around 6% higher clock speed: 5.4 GHz vs 5.1 GHz
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 19% better performance in PassMark - CPU mark: 34811 vs 29230

Specifications (specs)
Launch date	21 May 2024 vs 16 Apr 2024
Maximum frequency	5.4 GHz vs 5.1 GHz
L3 cache	32 MB (shared) vs 16 MB (shared)
Benchmarks
PassMark - CPU mark	34811 vs 29230

Compare benchmarks

CPU 1: AMD Ryzen 7 PRO 8845HS
CPU 2: AMD EPYC 4364P

PassMark - Single thread mark

CPU 1

CPU 2

3828

3661

PassMark - CPU mark

CPU 1

CPU 2

29230

34811

Name	AMD Ryzen 7 PRO 8845HS	AMD EPYC 4364P
PassMark - Single thread mark	3828	3661
PassMark - CPU mark	29230	34811

Compare specifications (specs)

	AMD Ryzen 7 PRO 8845HS	AMD EPYC 4364P
Essentials
Launch date	16 Apr 2024	21 May 2024
Place in performance rating	193	197
Launch price (MSRP)		$399
Performance
Base frequency	3.8 GHz	4.5 GHz
Die size	178 mm²	71 mm²
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	1 MB (per core)	1 MB (per core)
L3 cache	16 MB (shared)	32 MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C	95°C
Maximum frequency	5.1 GHz	5.4 GHz
Number of cores	8	8
Number of threads	16	16
Transistor count	25,000 million	6,570 million
Unlocked
Maximum case temperature (TCase)		61°C
Memory
ECC memory support
Supported memory types	DDR5	DDR5
Compatibility
Configurable TDP	35-54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP7	AM5
Thermal Design Power (TDP)	45 Watt	105 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 5, 28 Lanes, (CPU only)