AMD Ryzen 9 3900X vs Intel Xeon W-3175X
Comparative analysis of AMD Ryzen 9 3900X and Intel Xeon W-3175X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Ryzen 9 3900X
- CPU is newer: launch date 9 month(s) later
- Around 120953% higher clock speed: 4600 MHz vs 3.80 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 66% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.4x lower typical power consumption: 105 Watt vs 255 Watt
- Around 26% better performance in PassMark - Single thread mark: 2707 vs 2148
- Around 12% better performance in Geekbench 4 - Single Core: 1276 vs 1136
| Specifications (specs) | |
| Launch date | 7 July 2019 vs October 2018 |
| Maximum frequency | 4600 MHz vs 3.80 GHz |
| Manufacturing process technology | 7 nm vs 14 nm |
| L3 cache | 64 MB vs 38.5 MB (shared) |
| Thermal Design Power (TDP) | 105 Watt vs 255 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2707 vs 2148 |
| Geekbench 4 - Single Core | 1276 vs 1136 |
Reasons to consider the Intel Xeon W-3175X
- 16 more cores, run more applications at once: 28 vs 12
- 32 more threads: 56 vs 24
- 4.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 14% better performance in PassMark - CPU mark: 37167 vs 32659
- Around 94% better performance in Geekbench 4 - Multi-Core: 23343 vs 12037
| Specifications (specs) | |
| Number of cores | 28 vs 12 |
| Number of threads | 56 vs 24 |
| L2 cache | 1 MB (per core) vs 6 MB |
| Benchmarks | |
| PassMark - CPU mark | 37167 vs 32659 |
| Geekbench 4 - Multi-Core | 23343 vs 12037 |
Compare benchmarks
CPU 1: AMD Ryzen 9 3900X
CPU 2: Intel Xeon W-3175X
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | AMD Ryzen 9 3900X | Intel Xeon W-3175X |
|---|---|---|
| PassMark - Single thread mark | 2707 | 2148 |
| PassMark - CPU mark | 32659 | 37167 |
| Geekbench 4 - Single Core | 1276 | 1136 |
| Geekbench 4 - Multi-Core | 12037 | 23343 |
| 3DMark Fire Strike - Physics Score | 8594 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 30.575 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 72.097 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.745 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.887 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 22.686 |
Compare specifications (specs)
| AMD Ryzen 9 3900X | Intel Xeon W-3175X | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Skylake |
| Family | Ryzen | |
| Launch date | 7 July 2019 | October 2018 |
| OPN PIB | 100-100000023BOX | |
| OPN Tray | 100-000000023 | |
| Place in performance rating | 1006 | 461 |
| Vertical segment | Desktop | Desktop |
| Processor Number | W-3175X | |
| Series | Intel® Xeon® W Processor | |
| Status | Launched | |
Performance |
||
| Base frequency | 3800 MHz | 3.10 GHz |
| L2 cache | 6 MB | 1 MB (per core) |
| L3 cache | 64 MB | 38.5 MB (shared) |
| Manufacturing process technology | 7 nm | 14 nm |
| Maximum frequency | 4600 MHz | 3.80 GHz |
| Number of cores | 12 | 28 |
| Number of threads | 24 | 56 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s DMI3 | |
| L1 cache | 64K (per core) | |
| Maximum core temperature | 85°C | |
| Number of Ultra Path Interconnect (UPI) Links | 0 | |
| Transistor count | 8000 million | |
Memory |
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| Max memory channels | 2 | 6 |
| Supported memory types | DDR4-3200 | DDR4-2666 |
| Maximum memory size | 512 GB | |
| Supported memory frequency | 2666 MHz | |
Compatibility |
||
| Sockets supported | AM4 | FCLGA3647 |
| Thermal Design Power (TDP) | 105 Watt | 255 Watt |
| Max number of CPUs in a configuration | 1 | |
| Package Size | 76.0mm x 56.5mm | |
Peripherals |
||
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | x16 | |
| Max number of PCIe lanes | 48 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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