AMD Ryzen 9 7900 vs Intel Core i9-7900X
Comparative analysis of AMD Ryzen 9 7900 and Intel Core i9-7900X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 9 7900
- CPU is newer: launch date 5 year(s) 7 month(s) later
- 2 more cores, run more applications at once: 12 vs 10
- 4 more threads: 24 vs 20
- Around 26% higher clock speed: 5.4 GHz vs 4.30 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
- Around 20% more L1 cache; more data can be stored in the L1 cache for quick access later
- 4.8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.6x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.2x lower typical power consumption: 65 Watt vs 140 Watt
- Around 62% better performance in PassMark - Single thread mark: 4141 vs 2553
- 2.3x better performance in PassMark - CPU mark: 48529 vs 21032
- Around 58% better performance in 3DMark Fire Strike - Physics Score: 11047 vs 6987
| Specifications (specs) | |
| Launch date | 14 Jan 2023 vs 30 May 2017 |
| Number of cores | 12 vs 10 |
| Number of threads | 24 vs 20 |
| Maximum frequency | 5.4 GHz vs 4.30 GHz |
| Manufacturing process technology | 5 nm vs 14 nm |
| L1 cache | 768 KB vs 64 KB (per core) |
| L2 cache | 12 MB vs 256 KB (per core) |
| L3 cache | 64 MB vs 13.8 MB |
| Thermal Design Power (TDP) | 65 Watt vs 140 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 4141 vs 2553 |
| PassMark - CPU mark | 48529 vs 21032 |
| 3DMark Fire Strike - Physics Score | 11047 vs 6987 |
Compare benchmarks
CPU 1: AMD Ryzen 9 7900
CPU 2: Intel Core i9-7900X
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | AMD Ryzen 9 7900 | Intel Core i9-7900X |
|---|---|---|
| PassMark - Single thread mark | 4141 | 2553 |
| PassMark - CPU mark | 48529 | 21032 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 97.64 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 4.623 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 31.051 | |
| 3DMark Fire Strike - Physics Score | 11047 | 6987 |
| Geekbench 4 - Single Core | 1129 | |
| Geekbench 4 - Multi-Core | 10300 |
Compare specifications (specs)
| AMD Ryzen 9 7900 | Intel Core i9-7900X | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 4 | Skylake |
| Launch date | 14 Jan 2023 | 30 May 2017 |
| Launch price (MSRP) | $429 | $1,050 |
| OPN Tray | 100-000000590 | |
| Place in performance rating | 10 | 951 |
| Vertical segment | Desktop | Desktop |
| Price now | $1,383.99 | |
| Processor Number | i9-7900X | |
| Series | Intel® Core™ X-series Processors | |
| Status | Launched | |
| Value for money (0-100) | 4.68 | |
Performance |
||
| Base frequency | 3.7 GHz | 3.30 GHz |
| Die size | 71 mm² | |
| L1 cache | 768 KB | 64 KB (per core) |
| L2 cache | 12 MB | 256 KB (per core) |
| L3 cache | 64 MB | 13.8 MB |
| Manufacturing process technology | 5 nm | 14 nm |
| Maximum case temperature (TCase) | 47 °C | 72 °C |
| Maximum core temperature | 95 °C | 95°C |
| Maximum frequency | 5.4 GHz | 4.30 GHz |
| Number of cores | 12 | 10 |
| Number of threads | 24 | 20 |
| Transistor count | 13140 million | |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s DMI3 | |
| Number of QPI Links | 0 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 4 |
| Supported memory types | DDR5-5200 | DDR4-2666 |
| Maximum memory size | 128 GB | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM5 | FCLGA2066 |
| Thermal Design Power (TDP) | 65 Watt | 140 Watt |
| Low Halogen Options Available | ||
| Thermal Solution | PCG 2017X | |
Peripherals |
||
| Max number of PCIe lanes | 24 | 44 |
| PCI Express revision | 5.0 | 3.0 |
| Scalability | 1S Only | |
Advanced Technologies |
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| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
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