AMD Ryzen 9 7900X3D vs AMD Ryzen 9 7900X
Comparative analysis of AMD Ryzen 9 7900X3D and AMD Ryzen 9 7900X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 9 7900X3D
- CPU is newer: launch date 3 month(s) later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 42% lower typical power consumption: 120 Watt vs 170 Watt
Launch date | 4 Jan 2023 vs 27 Sep 2022 |
L3 cache | 128 MB vs 64 MB |
Thermal Design Power (TDP) | 120 Watt vs 170 Watt |
Reasons to consider the AMD Ryzen 9 7900X
- Around 12% higher maximum core temperature: 100 °C vs 89 °C
- Around 3% better performance in PassMark - Single thread mark: 4255 vs 4132
- Around 3% better performance in PassMark - CPU mark: 51717 vs 50405
- Around 10% better performance in 3DMark Fire Strike - Physics Score: 12732 vs 11579
Specifications (specs) | |
Maximum core temperature | 100 °C vs 89 °C |
Benchmarks | |
PassMark - Single thread mark | 4255 vs 4132 |
PassMark - CPU mark | 51717 vs 50405 |
3DMark Fire Strike - Physics Score | 12732 vs 11579 |
Compare benchmarks
CPU 1: AMD Ryzen 9 7900X3D
CPU 2: AMD Ryzen 9 7900X
PassMark - Single thread mark |
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PassMark - CPU mark |
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3DMark Fire Strike - Physics Score |
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Name | AMD Ryzen 9 7900X3D | AMD Ryzen 9 7900X |
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PassMark - Single thread mark | 4132 | 4255 |
PassMark - CPU mark | 50405 | 51717 |
3DMark Fire Strike - Physics Score | 11579 | 12732 |
Compare specifications (specs)
AMD Ryzen 9 7900X3D | AMD Ryzen 9 7900X | |
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Essentials |
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Architecture codename | Zen 4 | Zen 4 |
Launch date | 4 Jan 2023 | 27 Sep 2022 |
OPN Tray | 100-000000909 | 100-000000589 |
Place in performance rating | 108 | 86 |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $549 | |
Performance |
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Base frequency | 4.4 GHz | 4.7 GHz |
Die size | 71 mm² | 70 mm² |
L1 cache | 768 KB | 768 KB |
L2 cache | 12 MB | 12 MB |
L3 cache | 128 MB | 64 MB |
Manufacturing process technology | 5 nm | 5 nm |
Maximum case temperature (TCase) | 47 °C | 47 °C |
Maximum core temperature | 89 °C | 100 °C |
Maximum frequency | 5.6 GHz | 5.6 GHz |
Number of cores | 12 | 12 |
Number of threads | 24 | 24 |
Transistor count | 13140 million | 13140 million |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR5-5200 | DDR5-5200 |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM5 | AM5 |
Thermal Design Power (TDP) | 120 Watt | 170 Watt |
Peripherals |
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Max number of PCIe lanes | 24 | 24 |
PCI Express revision | 5.0 | 5.0 |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |