AMD Ryzen 9 7950X3D vs Intel Xeon E5649
Comparative analysis of AMD Ryzen 9 7950X3D and Intel Xeon E5649 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the AMD Ryzen 9 7950X3D
- CPU is newer: launch date 11 year(s) 7 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 10 more cores, run more applications at once: 16 vs 6
- 20 more threads: 32 vs 12
- Around 95% higher clock speed: 5.7 GHz vs 2.93 GHz
- Around 17% higher maximum core temperature: 89 °C vs 76.2°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 32 nm
- 2.7x more L1 cache, more data can be stored in the L1 cache for quick access later
- 10.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 10.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- 3.4x better performance in PassMark - Single thread mark: 4149 vs 1219
- 6.5x better performance in PassMark - CPU mark: 62439 vs 9554
Specifications (specs) | |
Launch date | 27 Sep 2022 vs February 2011 |
Unlocked | Unlocked vs Locked |
Number of cores | 16 vs 6 |
Number of threads | 32 vs 12 |
Maximum frequency | 5.7 GHz vs 2.93 GHz |
Maximum core temperature | 89 °C vs 76.2°C |
Manufacturing process technology | 5 nm vs 32 nm |
L1 cache | 1 MB vs 64 KB (per core) |
L2 cache | 16 MB vs 256 KB (per core) |
L3 cache | 128 MB vs 12288 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 4149 vs 1219 |
PassMark - CPU mark | 62439 vs 9554 |
Reasons to consider the Intel Xeon E5649
- Around 50% lower typical power consumption: 80 Watt vs 120 Watt
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 80 Watt vs 120 Watt |
Compare benchmarks
CPU 1: AMD Ryzen 9 7950X3D
CPU 2: Intel Xeon E5649
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 9 7950X3D | Intel Xeon E5649 |
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PassMark - Single thread mark | 4149 | 1219 |
PassMark - CPU mark | 62439 | 9554 |
3DMark Fire Strike - Physics Score | 14290 | |
Geekbench 4 - Single Core | 470 | |
Geekbench 4 - Multi-Core | 2849 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.594 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 25.435 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.647 |
Compare specifications (specs)
AMD Ryzen 9 7950X3D | Intel Xeon E5649 | |
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Essentials |
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Architecture codename | Zen 4 | Westmere EP |
Launch date | 27 Sep 2022 | February 2011 |
OPN Tray | 100-000000908 | |
Place in performance rating | 55 | 2424 |
Vertical segment | Desktop | Server |
Launch price (MSRP) | $45 | |
Price now | $115 | |
Processor Number | E5649 | |
Series | Legacy Intel® Xeon® Processors | |
Status | Launched | |
Value for money (0-100) | 17.77 | |
Performance |
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Base frequency | 4.2 GHz | 2.53 GHz |
Die size | 71 mm² | 239 mm |
L1 cache | 1 MB | 64 KB (per core) |
L2 cache | 16 MB | 256 KB (per core) |
L3 cache | 128 MB | 12288 KB (shared) |
Manufacturing process technology | 5 nm | 32 nm |
Maximum case temperature (TCase) | 47 °C | |
Maximum core temperature | 89 °C | 76.2°C |
Maximum frequency | 5.7 GHz | 2.93 GHz |
Number of cores | 16 | 6 |
Number of threads | 32 | 12 |
Transistor count | 13140 million | 1170 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5.86 GT/s QPI | |
Number of QPI Links | 2 | |
VID voltage range | 0.750V-1.350V | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 3 |
Supported memory types | DDR5-5200 | DDR3 800/1066/1333 |
Maximum memory bandwidth | 32 GB/s | |
Maximum memory size | 288 GB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | AM5 | FCLGA1366 |
Thermal Design Power (TDP) | 120 Watt | 80 Watt |
Low Halogen Options Available | ||
Package Size | 42.5mm X 45mm | |
Peripherals |
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Max number of PCIe lanes | 24 | |
PCI Express revision | 5.0 | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |