AMD Ryzen Embedded R1305G vs Intel Core i5-4570TE
Comparative analysis of AMD Ryzen Embedded R1305G and Intel Core i5-4570TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded R1305G
- CPU is newer: launch date 6 year(s) 8 month(s) later
- Around 84748% higher clock speed: 2800 MHz vs 3.30 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.4x lower typical power consumption: 8 Watt vs 35 Watt
| Launch date | 25 Feb 2020 vs June 2013 |
| Maximum frequency | 2800 MHz vs 3.30 GHz |
| Manufacturing process technology | 14 nm vs 22 nm |
| L1 cache | 192 KB vs 64 KB (per core) |
| L2 cache | 1 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 8 Watt vs 35 Watt |
Reasons to consider the Intel Core i5-4570TE
- Around 3% better performance in PassMark - Single thread mark: 1643 vs 1593
- Around 1% better performance in PassMark - CPU mark: 3097 vs 3052
| Benchmarks | |
| PassMark - Single thread mark | 1643 vs 1593 |
| PassMark - CPU mark | 3097 vs 3052 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R1305G
CPU 2: Intel Core i5-4570TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen Embedded R1305G | Intel Core i5-4570TE |
|---|---|---|
| PassMark - Single thread mark | 1593 | 1643 |
| PassMark - CPU mark | 3052 | 3097 |
Compare specifications (specs)
| AMD Ryzen Embedded R1305G | Intel Core i5-4570TE | |
|---|---|---|
Essentials |
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| Architecture codename | Zen | Haswell |
| Family | Ryzen Embedded | |
| Launch date | 25 Feb 2020 | June 2013 |
| Place in performance rating | 1608 | 1573 |
| Series | R1000 | 4th Generation Intel® Core™ i5 Processors |
| Vertical segment | Embedded | Embedded |
| Launch price (MSRP) | $239 | |
| Price now | $198.99 | |
| Processor Number | i5-4570TE | |
| Status | Launched | |
| Value for money (0-100) | 5.67 | |
Performance |
||
| Base frequency | 1500 MHz | 2.70 GHz |
| L1 cache | 192 KB | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| L3 cache | 4 MB | 4096 KB (shared) |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum frequency | 2800 MHz | 3.30 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 4 |
| 64 bit support | ||
| Bus Speed | 5 GT/s DMI | |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 72 °C | |
| Maximum core temperature | 66.35°C | |
| Transistor count | 1400 million | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 35.76 GB/s | 25.6 GB/s |
| Maximum memory size | 32 GB | 32 GB |
| Supported memory types | DDR4-2400 | DDR3 1333/1600 |
Graphics |
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| Execution Units | 3 | |
| Graphics max frequency | 1000 MHz | 1 GHz |
| Number of pipelines | 192 | |
| Processor graphics | Radeon Vega 3 | Intel® HD Graphics 4600 |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 1.7 GB | |
Graphics interfaces |
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| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 3 |
| Wireless Display (WiDi) support | ||
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.6 | |
Compatibility |
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| Configurable TDP-up | 10 Watt | |
| Thermal Design Power (TDP) | 8 Watt | 35 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm (LGA 1150) | |
| Sockets supported | FCLGA1150 | |
| Thermal Solution | PCG 2013A | |
Peripherals |
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| Integrated LAN | ||
| Max number of PCIe lanes | 8 | 16 |
| Number of USB ports | 4 | |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x8 | Up to 1x16, 2x8, 1x8 2x4 |
| Total number of SATA ports | 2 | |
| Scalability | 1S Only | |
Advanced Technologies |
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| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
