AMD Ryzen Embedded V1500B vs Intel Core i9-8950HK

Comparative analysis of AMD Ryzen Embedded V1500B and Intel Core i9-8950HK processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the AMD Ryzen Embedded V1500B

  • CPU is newer: launch date 6 year(s) 9 month(s) later
  • Around 5% higher maximum core temperature: 105 °C vs 100°C
  • Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 2.8x lower typical power consumption: 16 Watt vs 45 Watt
Launch date 2018 vs 3 March 2018
Maximum core temperature 105 °C vs 100°C
L2 cache 2 MB vs 1.5 MB
Thermal Design Power (TDP) 16 Watt vs 45 Watt

Reasons to consider the Intel Core i9-8950HK

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 2 more cores, run more applications at once: 6 vs 4
  • 4 more threads: 12 vs 8
  • 3x more L3 cache, more data can be stored in the L3 cache for quick access later
  • 2x more maximum memory size: 64 GB vs 32 GB
  • 2x better performance in PassMark - Single thread mark: 2429 vs 1211
  • 2.3x better performance in PassMark - CPU mark: 10455 vs 4633
Specifications (specs)
Unlocked Unlocked vs Locked
Number of cores 6 vs 4
Number of threads 12 vs 8
L3 cache 12 MB vs 4 MB
Maximum memory size 64 GB vs 32 GB
Benchmarks
PassMark - Single thread mark 2429 vs 1211
PassMark - CPU mark 10455 vs 4633

Compare benchmarks

CPU 1: AMD Ryzen Embedded V1500B
CPU 2: Intel Core i9-8950HK

PassMark - Single thread mark
CPU 1
CPU 2
1211
2429
PassMark - CPU mark
CPU 1
CPU 2
4633
10455
Name AMD Ryzen Embedded V1500B Intel Core i9-8950HK
PassMark - Single thread mark 1211 2429
PassMark - CPU mark 4633 10455
Geekbench 4 - Single Core 1117
Geekbench 4 - Multi-Core 5166
3DMark Fire Strike - Physics Score 5686
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 7.809
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 65.701
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.914
CompuBench 1.5 Desktop - Video Composition (Frames/s) 3.409
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 8.455
GFXBench 4.0 - Car Chase Offscreen (Frames) 1687
GFXBench 4.0 - Manhattan (Frames) 812
GFXBench 4.0 - T-Rex (Frames) 1678
GFXBench 4.0 - Car Chase Offscreen (Fps) 1687
GFXBench 4.0 - Manhattan (Fps) 812
GFXBench 4.0 - T-Rex (Fps) 1678

Compare specifications (specs)

AMD Ryzen Embedded V1500B Intel Core i9-8950HK

Essentials

Architecture codename Zen Coffee Lake
Launch date 2018 3 March 2018
OPN Tray YE1500C4T4MFB
Place in performance rating 1937 1769
Vertical segment Embedded Mobile
Launch price (MSRP) $583
Price now $583
Processor Number i9-8950HK
Series 8th Generation Intel® Core™ i9 Processors
Status Launched
Value for money (0-100) 7.32

Performance

64 bit support
Base frequency 2.2 GHz 2.90 GHz
L1 cache 384 KB 384 KB
L2 cache 2 MB 1.5 MB
L3 cache 4 MB 12 MB
Manufacturing process technology 14 nm 14 nm
Maximum core temperature 105 °C 100°C
Number of cores 4 6
Number of threads 8 12
Bus Speed 8 GT/s DMI
Die size 149 mm
Maximum case temperature (TCase) 72 °C
Maximum frequency 4.80 GHz
Unlocked

Memory

ECC memory support
Max memory channels 2 2
Maximum memory size 32 GB 64 GB
Supported memory types DDR4-2400 DDR4-2666, LPDDR3-2133
Maximum memory bandwidth 41.8 GB/s

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP5 FCBGA1440
Thermal Design Power (TDP) 16 Watt 45 Watt
Low Halogen Options Available
Package Size 42mm x 28mm

Advanced Technologies

Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® Thermal Velocity Boost
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Speed Shift technology
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Device ID 0x3E9B
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.20 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel® UHD Graphics 630

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3

Graphics image quality

4K resolution support
Max resolution over DisplayPort 4096x2304@60Hz
Max resolution over eDP 4096x2304@60Hz
Max resolution over HDMI 1.4 4096x2304@30Hz

Graphics API support

DirectX 12
OpenGL 4.5

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)