AMD Ryzen Embedded V1500B vs Intel Pentium G3320TE

Comparative analysis of AMD Ryzen Embedded V1500B and Intel Pentium G3320TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded V1500B

  • 2 more cores, run more applications at once: 4 vs 2
  • 6 more threads: 8 vs 2
  • Around 46% higher maximum core temperature: 105 °C vs 72°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 2.2x lower typical power consumption: 16 Watt vs 35 Watt
  • 2.9x better performance in PassMark - CPU mark: 4584 vs 1570
Specifications (specs)
Number of cores 4 vs 2
Number of threads 8 vs 2
Maximum core temperature 105 °C vs 72°C
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 16 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark 4584 vs 1570

Reasons to consider the Intel Pentium G3320TE

  • Around 11% better performance in PassMark - Single thread mark: 1312 vs 1186
Benchmarks
PassMark - Single thread mark 1312 vs 1186

Compare benchmarks

CPU 1: AMD Ryzen Embedded V1500B
CPU 2: Intel Pentium G3320TE

PassMark - Single thread mark
CPU 1
CPU 2
1186
1312
PassMark - CPU mark
CPU 1
CPU 2
4584
1570
Name AMD Ryzen Embedded V1500B Intel Pentium G3320TE
PassMark - Single thread mark 1186 1312
PassMark - CPU mark 4584 1570

Compare specifications (specs)

AMD Ryzen Embedded V1500B Intel Pentium G3320TE

Essentials

Architecture codename Zen Haswell
Launch date 2018 Q3'13
OPN Tray YE1500C4T4MFB
Place in performance rating 1866 1833
Vertical segment Embedded Embedded
Processor Number G3320TE
Series Intel® Pentium® Processor G Series
Status Launched

Performance

64 bit support
Base frequency 2.2 GHz 2.30 GHz
L1 cache 384 KB
L2 cache 2 MB
L3 cache 4 MB
Manufacturing process technology 14 nm 22 nm
Maximum core temperature 105 °C 72°C
Number of cores 4 2
Number of threads 8 2
Bus Speed 5 GT/s DMI2
Number of QPI Links 1

Memory

ECC memory support
Max memory channels 2 2
Maximum memory size 32 GB 32 GB
Supported memory types DDR4-2400 DDR3-1333, DDR3L-1333 @ 1.5V
Maximum memory bandwidth 21.3 GB/s

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP5 FCLGA1150
Thermal Design Power (TDP) 16 Watt 35 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Thermal Solution PCG 2013A

Advanced Technologies

Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory 1 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8/2x4

Security & Reliability

Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)