AMD Ryzen Embedded V1500B vs Intel Pentium G3320TE

Comparative analysis of AMD Ryzen Embedded V1500B and Intel Pentium G3320TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen Embedded V1500B

Intel Pentium G3320TE

Differences

Reasons to consider the AMD Ryzen Embedded V1500B

2 more cores, run more applications at once: 4 vs 2
6 more threads: 8 vs 2
Around 46% higher maximum core temperature: 105 °C vs 72°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
2.2x lower typical power consumption: 16 Watt vs 35 Watt
3x better performance in PassMark - CPU mark: 4633 vs 1570

Specifications (specs)
Number of cores	4 vs 2
Number of threads	8 vs 2
Maximum core temperature	105 °C vs 72°C
Manufacturing process technology	14 nm vs 22 nm
Thermal Design Power (TDP)	16 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark	4633 vs 1570

Reasons to consider the Intel Pentium G3320TE

Around 8% better performance in PassMark - Single thread mark: 1312 vs 1211

Benchmarks
PassMark - Single thread mark	1312 vs 1211

Compare benchmarks

CPU 1: AMD Ryzen Embedded V1500B
CPU 2: Intel Pentium G3320TE

PassMark - Single thread mark

CPU 1

CPU 2

1211

1312

PassMark - CPU mark

CPU 1

CPU 2

4633

1570

Name	AMD Ryzen Embedded V1500B	Intel Pentium G3320TE
PassMark - Single thread mark	1211	1312
PassMark - CPU mark	4633	1570

Compare specifications (specs)

	AMD Ryzen Embedded V1500B	Intel Pentium G3320TE
Essentials
Architecture codename	Zen	Haswell
Launch date	2018	Q3'13
OPN Tray	YE1500C4T4MFB
Place in performance rating	1938	1928
Vertical segment	Embedded	Embedded
Processor Number		G3320TE
Series		Intel® Pentium® Processor G Series
Status		Launched
Performance
64 bit support
Base frequency	2.2 GHz	2.30 GHz
L1 cache	384 KB
L2 cache	2 MB
L3 cache	4 MB
Manufacturing process technology	14 nm	22 nm
Maximum core temperature	105 °C	72°C
Number of cores	4	2
Number of threads	8	2
Bus Speed		5 GT/s DMI2
Number of QPI Links		1
Memory
ECC memory support
Max memory channels	2	2
Maximum memory size	32 GB	32 GB
Supported memory types	DDR4-2400	DDR3-1333, DDR3L-1333 @ 1.5V
Maximum memory bandwidth		21.3 GB/s
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	FP5	FCLGA1150
Thermal Design Power (TDP)	16 Watt	35 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Thermal Solution		PCG 2013A
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory		1 GB
Processor graphics		Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
VGA
Peripherals
Max number of PCIe lanes		16
PCI Express revision		3.0
PCIe configurations		Up to 1x16, 2x8, 1x8/2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)