AMD Ryzen Embedded V3C18I vs AMD Ryzen 7 PRO 4750G

Comparative analysis of AMD Ryzen Embedded V3C18I and AMD Ryzen 7 PRO 4750G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen Embedded V3C18I

AMD Ryzen 7 PRO 4750G

Differences

Reasons to consider the AMD Ryzen Embedded V3C18I

CPU is newer: launch date 2 year(s) 2 month(s) later
Around 11% higher maximum core temperature: 105°C vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
2x more L3 cache, more data can be stored in the L3 cache for quick access later
4.3x lower typical power consumption: 15 Watt vs 65 Watt
Around 4% better performance in PassMark - Single thread mark: 2836 vs 2715

Specifications (specs)
Launch date	27 Sep 2022 vs 21 Jul 2020
Maximum core temperature	105°C vs 95 °C
Manufacturing process technology	6 nm vs 7 nm
L3 cache	16 MB (shared) vs 8 MB
Thermal Design Power (TDP)	15 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark	2836 vs 2715

Reasons to consider the AMD Ryzen 7 PRO 4750G

Around 16% higher clock speed: 4.4 GHz vs 3.8 GHz
Around 20% better performance in PassMark - CPU mark: 20447 vs 17053

Specifications (specs)
Maximum frequency	4.4 GHz vs 3.8 GHz
Benchmarks
PassMark - CPU mark	20447 vs 17053

Compare benchmarks

CPU 1: AMD Ryzen Embedded V3C18I
CPU 2: AMD Ryzen 7 PRO 4750G

PassMark - Single thread mark

CPU 1

CPU 2

2836

2715

PassMark - CPU mark

CPU 1

CPU 2

17053

20447

Name	AMD Ryzen Embedded V3C18I	AMD Ryzen 7 PRO 4750G
PassMark - Single thread mark	2836	2715
PassMark - CPU mark	17053	20447
3DMark Fire Strike - Physics Score		9166

Compare specifications (specs)

	AMD Ryzen Embedded V3C18I	AMD Ryzen 7 PRO 4750G
Essentials
Launch date	27 Sep 2022	21 Jul 2020
Place in performance rating	686	676
Architecture codename		Zen 2
OPN Tray		100-000000145
Vertical segment		Desktop
Performance
Base frequency	1900 MHz	3.6 GHz
L1 cache	64 KB (per core)	512 KB
L2 cache	512 KB (per core)	4 MB
L3 cache	16 MB (shared)	8 MB
Manufacturing process technology	6 nm	7 nm
Maximum core temperature	105°C	95 °C
Maximum frequency	3.8 GHz	4.4 GHz
Number of cores	8	8
Number of threads	16	16
Unlocked
Number of GPU cores		8
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		2
Compatibility
Configurable TDP	10-25 Watt	45-65 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP7	AM4
Thermal Design Power (TDP)	15 Watt	65 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
PCI Express revision		3.0
Graphics interfaces
DisplayPort
HDMI