AMD Sempron 180 vs Intel Atom E640
Comparative analysis of AMD Sempron 180 and Intel Atom E640 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Graphics, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the AMD Sempron 180
- 1 more cores, run more applications at once: 2 vs 1
- Around 140% higher clock speed: 2.4 GHz vs 1 GHz
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| Number of cores | 2 vs 1 |
| Maximum frequency | 2.4 GHz vs 1 GHz |
| L1 cache | 128 KB (per core) vs 64 KB (per core) |
| L2 cache | 512 KB (per core) vs 512 KB (per core) |
Reasons to consider the Intel Atom E640
- 11.3x lower typical power consumption: 3.6 Watt vs 45 Watt
| Thermal Design Power (TDP) | 3.6 Watt vs 45 Watt |
Compare specifications (specs)
| AMD Sempron 180 | Intel Atom E640 | |
|---|---|---|
Essentials |
||
| Architecture codename | Regor | Tunnel Creek |
| Launch date | September 2010 | September 2010 |
| Place in performance rating | not rated | not rated |
| Vertical segment | Desktop | Embedded |
| Processor Number | E640 | |
| Series | Legacy Intel Atom® Processors | |
| Status | Launched | |
Performance |
||
| 64 bit support | ||
| Die size | 117 mm | 26 mm |
| L1 cache | 128 KB (per core) | 64 KB (per core) |
| L2 cache | 512 KB (per core) | 512 KB (per core) |
| Manufacturing process technology | 45 nm | 45 nm |
| Maximum frequency | 2.4 GHz | 1 GHz |
| Number of cores | 2 | 1 |
| Transistor count | 234 million | 47 million |
| Base frequency | 1.00 GHz | |
| Bus Speed | 2500 MHz PCIE | |
| Maximum core temperature | 90°C | |
| Number of threads | 2 | |
| VID voltage range | VCC (0.75 - 0.9V), VNN (0.75 - 1.1V) | |
Memory |
||
| Supported memory types | DDR3 | DDR2 800 |
| Max memory channels | 1 | |
| Maximum memory size | 2 GB | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM3 | FCBGA676 |
| Thermal Design Power (TDP) | 45 Watt | 3.6 Watt |
| Low Halogen Options Available | ||
| Package Size | 22mmx22mm | |
Graphics |
||
| Graphics base frequency | 320 MHz | |
| Processor graphics | Integrated | |
Peripherals |
||
| Max number of PCIe lanes | 4 | |
| PCI Express revision | 1.0a | |
| PCIe configurations | x1, root complex only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||