Apple A17 Pro vs AMD Ryzen 9 7945HX3D

Comparative analysis of Apple A17 Pro and AMD Ryzen 9 7945HX3D processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Apple A17 Pro

  • CPU is newer: launch date 1 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 3 nm vs 5 nm
  • 1048576x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 11% better performance in PassMark - Single thread mark: 4544 vs 4083
Specifications (specs)
Launch date Sep 2023 vs 27 Jul 2023
Manufacturing process technology 3 nm vs 5 nm
L2 cache 16 MB vs 1MB (per core)
Benchmarks
PassMark - Single thread mark 4544 vs 4083

Reasons to consider the AMD Ryzen 9 7945HX3D

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 10 more cores, run more applications at once: 16 vs 6
  • 26 more threads: 32 vs 6
  • Around 43% higher clock speed: 5.4 GHz vs 3.78 GHz
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4.7x better performance in PassMark - CPU mark: 57570 vs 12243
Specifications (specs)
Unlocked Unlocked vs Locked
Number of cores 16 vs 6
Number of threads 32 vs 6
Maximum frequency 5.4 GHz vs 3.78 GHz
L1 cache 64K (per core) vs 256 KB
Benchmarks
PassMark - CPU mark 57570 vs 12243

Compare benchmarks

CPU 1: Apple A17 Pro
CPU 2: AMD Ryzen 9 7945HX3D

PassMark - Single thread mark
CPU 1
CPU 2
4544
4083
PassMark - CPU mark
CPU 1
CPU 2
12243
57570
Name Apple A17 Pro AMD Ryzen 9 7945HX3D
PassMark - Single thread mark 4544 4083
PassMark - CPU mark 12243 57570

Compare specifications (specs)

Apple A17 Pro AMD Ryzen 9 7945HX3D

Essentials

Launch date Sep 2023 27 Jul 2023
Place in performance rating 142 62
Processor Number APL1V02
Vertical segment Mobile

Performance

Base frequency 2.02 GHz 2.3 GHz
L1 cache 256 KB 64K (per core)
L2 cache 16 MB 1MB (per core)
Manufacturing process technology 3 nm 5 nm
Maximum frequency 3.78 GHz 5.4 GHz
Number of cores 6 16
Number of threads 6 32
Transistor count 19 billion 17,840 million
Die size 2x 71 mm²
L3 cache 128MB (shared)
Maximum core temperature 100°C
Unlocked

Memory

Max memory channels 1
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 6 GB
Supported memory types LPDDR5-6400 DDR5-5200 MHz, Dual-channel
ECC memory support

Graphics

Execution Units 20
Graphics base frequency 1398 MHz
iGPU core count 6

Compatibility

Max number of CPUs in a configuration 1
Sockets supported FL1
Thermal Design Power (TDP) 55 Watt

Peripherals

PCIe configurations Gen 5, 28 Lanes, (CPU only)