Intel 300 vs AMD Ryzen 9 PRO 3900
Comparative analysis of Intel 300 and AMD Ryzen 9 PRO 3900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel 300
- CPU is newer: launch date 4 year(s) 3 month(s) later
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- Around 41% lower typical power consumption: 46 Watt vs 65 Watt
- Around 21% better performance in PassMark - Single thread mark: 3235 vs 2681
Specifications (specs) | |
Launch date | 8 Jan 2024 vs 30 Sep 2019 |
Maximum core temperature | 100°C vs 95 °C |
Thermal Design Power (TDP) | 46 Watt vs 65 Watt |
Benchmarks | |
PassMark - Single thread mark | 3235 vs 2681 |
Reasons to consider the AMD Ryzen 9 PRO 3900
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 10 more cores, run more applications at once: 12 vs 2
- 20 more threads: 24 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
- 4.8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 10.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4.4x better performance in PassMark - CPU mark: 31616 vs 7160
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Number of cores | 12 vs 2 |
Number of threads | 24 vs 4 |
Manufacturing process technology | 7 nm vs 10 nm |
L1 cache | 768 KB vs 80 KB (per core) |
L2 cache | 6 MB vs 1.25 MB (per core) |
L3 cache | 64 MB vs 6 MB (shared) |
Benchmarks | |
PassMark - CPU mark | 31616 vs 7160 |
Compare benchmarks
CPU 1: Intel 300
CPU 2: AMD Ryzen 9 PRO 3900
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | Intel 300 | AMD Ryzen 9 PRO 3900 |
---|---|---|
PassMark - Single thread mark | 3235 | 2681 |
PassMark - CPU mark | 7160 | 31616 |
3DMark Fire Strike - Physics Score | 7891 |
Compare specifications (specs)
Intel 300 | AMD Ryzen 9 PRO 3900 | |
---|---|---|
Essentials |
||
Launch date | 8 Jan 2024 | 30 Sep 2019 |
Launch price (MSRP) | $82 | |
Place in performance rating | 647 | 656 |
Architecture codename | Zen 2 | |
Family | Ryzen 9 | |
OPN Tray | 100-000000072 | |
Processor Number | PRO 3900 | |
Vertical segment | Desktop | |
Performance |
||
Base frequency | 3.9 GHz | 3.1 GHz |
Die size | 163 mm² | |
L1 cache | 80 KB (per core) | 768 KB |
L2 cache | 1.25 MB (per core) | 6 MB |
L3 cache | 6 MB (shared) | 64 MB |
Manufacturing process technology | 10 nm | 7 nm |
Maximum core temperature | 100°C | 95 °C |
Number of cores | 2 | 12 |
Number of threads | 4 | 24 |
Unlocked | ||
Maximum frequency | 4.3 GHz | |
Memory |
||
ECC memory support | ||
Supported memory types | DDR4, DDR5 | DDR4-3200 |
Max memory channels | 2 | |
Maximum memory bandwidth | 47.68 GB/s | |
Maximum memory size | 128 GB | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | 1700 | AM4 |
Thermal Design Power (TDP) | 46 Watt | 65 Watt |
Peripherals |
||
PCIe configurations | Gen 5, 16 Lanes, (CPU only) | 1x16+x4, 2x8+x4, 1x8+2x4+x4 |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
||
AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
||
AMD Virtualization (AMD-V™) |