Intel Atom N475 vs Intel Celeron M 900

Comparative analysis of Intel Atom N475 and Intel Celeron M 900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Atom N475

  • CPU is newer: launch date 1 year(s) 0 month(s) later
  • 1 more threads: 2 vs 1
  • 5x lower typical power consumption: 6.5 Watt vs 35 Watt
  • Around 7% better performance in PassMark - Single thread mark: 281 vs 263
Specifications (specs)
Launch date 1 May 2010 vs 1 April 2009
Number of threads 2 vs 1
Thermal Design Power (TDP) 6.5 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 281 vs 263

Reasons to consider the Intel Celeron M 900

  • Around 20% higher clock speed: 2.2 GHz vs 1.83 GHz
  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 14% better performance in PassMark - CPU mark: 204 vs 179
Specifications (specs)
Maximum frequency 2.2 GHz vs 1.83 GHz
Maximum core temperature 105°C vs 100°C
L2 cache 1024 KB vs 512 KB
Benchmarks
PassMark - CPU mark 204 vs 179

Compare benchmarks

CPU 1: Intel Atom N475
CPU 2: Intel Celeron M 900

PassMark - Single thread mark
CPU 1
CPU 2
281
263
PassMark - CPU mark
CPU 1
CPU 2
179
204
Name Intel Atom N475 Intel Celeron M 900
PassMark - Single thread mark 281 263
PassMark - CPU mark 179 204

Compare specifications (specs)

Intel Atom N475 Intel Celeron M 900

Essentials

Architecture codename Pineview Penryn
Launch date 1 May 2010 1 April 2009
Launch price (MSRP) $75 $70
Place in performance rating 3253 3260
Processor Number N475 900
Series Legacy Intel Atom® Processors Legacy Intel® Celeron® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.83 GHz 2.20 GHz
Bus Speed 2.5 GT/s DMI 800 MHz FSB
Die size 66 mm2 107 mm2
Front-side bus (FSB) 533 MHz 800 MHz
L1 cache 64 KB (per core)
L2 cache 512 KB 1024 KB
Manufacturing process technology 45 nm 45 nm
Maximum core temperature 100°C 105°C
Maximum frequency 1.83 GHz 2.2 GHz
Number of cores 1 1
Number of threads 2 1
Transistor count 123 million 410 million

Memory

Max memory channels 1
Maximum memory size 2 GB
Supported memory types DDR2/3

Graphics

Graphics base frequency 200 MHz
Processor graphics Integrated

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 22mm x 22mm 35mm x 35mm
Sockets supported FCBGA559 PGA478
Thermal Design Power (TDP) 6.5 Watt 35 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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