Intel Atom N475 vs Intel Celeron M 900
Comparative analysis of Intel Atom N475 and Intel Celeron M 900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Atom N475
- CPU is newer: launch date 1 year(s) 1 month(s) later
- 1 more threads: 2 vs 1
- 5x lower typical power consumption: 6.5 Watt vs 35 Watt
- Around 7% better performance in PassMark - Single thread mark: 281 vs 263
| Specifications (specs) | |
| Launch date | 1 May 2010 vs 1 April 2009 |
| Number of threads | 2 vs 1 |
| Thermal Design Power (TDP) | 6.5 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 281 vs 263 |
Reasons to consider the Intel Celeron M 900
- Around 20% higher clock speed: 2.2 GHz vs 1.83 GHz
- Around 5% higher maximum core temperature: 105°C vs 100°C
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 14% better performance in PassMark - CPU mark: 204 vs 179
| Specifications (specs) | |
| Maximum frequency | 2.2 GHz vs 1.83 GHz |
| Maximum core temperature | 105°C vs 100°C |
| L2 cache | 1024 KB vs 512 KB |
| Benchmarks | |
| PassMark - CPU mark | 204 vs 179 |
Compare benchmarks
CPU 1: Intel Atom N475
CPU 2: Intel Celeron M 900
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Atom N475 | Intel Celeron M 900 |
|---|---|---|
| PassMark - Single thread mark | 281 | 263 |
| PassMark - CPU mark | 179 | 204 |
Compare specifications (specs)
| Intel Atom N475 | Intel Celeron M 900 | |
|---|---|---|
Essentials |
||
| Architecture codename | Pineview | Penryn |
| Launch date | 1 May 2010 | 1 April 2009 |
| Launch price (MSRP) | $75 | $70 |
| Place in performance rating | 3265 | 3272 |
| Processor Number | N475 | 900 |
| Series | Legacy Intel Atom® Processors | Legacy Intel® Celeron® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.83 GHz | 2.20 GHz |
| Bus Speed | 2.5 GT/s DMI | 800 MHz FSB |
| Die size | 66 mm2 | 107 mm2 |
| Front-side bus (FSB) | 533 MHz | 800 MHz |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB | 1024 KB |
| Manufacturing process technology | 45 nm | 45 nm |
| Maximum core temperature | 100°C | 105°C |
| Maximum frequency | 1.83 GHz | 2.2 GHz |
| Number of cores | 1 | 1 |
| Number of threads | 2 | 1 |
| Transistor count | 123 million | 410 million |
Memory |
||
| Max memory channels | 1 | |
| Maximum memory size | 2 GB | |
| Supported memory types | DDR2/3 | |
Graphics |
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| Graphics base frequency | 200 MHz | |
| Processor graphics | Integrated | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 22mm x 22mm | 35mm x 35mm |
| Sockets supported | FCBGA559 | PGA478 |
| Thermal Design Power (TDP) | 6.5 Watt | 35 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||