Intel Atom S1289 vs Intel Atom Z670
Comparative analysis of Intel Atom S1289 and Intel Atom Z670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Atom S1289
- 1 more cores, run more applications at once: 2 vs 1
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2.7x more maximum memory size: 8 GB vs 2.93 GB
Number of cores | 2 vs 1 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 32 nm vs 45 nm |
Maximum memory size | 8 GB vs 2.93 GB |
Reasons to consider the Intel Atom Z670
- 4.7x lower typical power consumption: 3 Watt vs 14.1 Watt
Thermal Design Power (TDP) | 3 Watt vs 14.1 Watt |
Compare benchmarks
CPU 1: Intel Atom S1289
CPU 2: Intel Atom Z670
Name | Intel Atom S1289 | Intel Atom Z670 |
---|---|---|
PassMark - Single thread mark | 95 | |
PassMark - CPU mark | 158 |
Compare specifications (specs)
Intel Atom S1289 | Intel Atom Z670 | |
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Essentials |
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Architecture codename | Briarwood | Lincroft |
Launch date | Q2'13 | April 2011 |
Place in performance rating | not rated | 3324 |
Processor Number | S1289 | Z670 |
Series | Intel® Atom™ Processor S Series | Legacy Intel Atom® Processors |
Status | Launched | Discontinued |
Vertical segment | Server | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 1.50 GHz |
Manufacturing process technology | 32 nm | 45 nm |
Number of cores | 2 | 1 |
Number of threads | 4 | 2 |
Die size | 65 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 512 KB (per core) | |
Maximum core temperature | 90 | |
Maximum frequency | 1.5 GHz | |
Transistor count | 140 million | |
VID voltage range | 1.1125-1.5000V | |
Memory |
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Max memory channels | 1 | 1 |
Maximum memory size | 8 GB | 2.93 GB |
Supported memory types | DDR3 1333 | DDR2 800 |
Compatibility |
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Low Halogen Options Available | ||
Sockets supported | FCBGA1283 | T-PBGA518 |
Thermal Design Power (TDP) | 14.1 Watt | 3 Watt |
Max number of CPUs in a configuration | 1 | |
Package Size | 13.8mmx13.8mm | |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 2.0 | |
PCI support | ||
UART | ||
Advanced Technologies |
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Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Graphics |
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Graphics base frequency | 400 MHz | |
Processor graphics | Integrated | |
Graphics interfaces |
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LVDS | ||
Security & Reliability |
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Execute Disable Bit (EDB) |