Intel Atom Z3560 vs Intel Celeron 887
Comparative analysis of Intel Atom Z3560 and Intel Celeron 887 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom Z3560
- 2 more cores, run more applications at once: 4 vs 2
- 2 more threads: 4 vs 2
- Around 22% higher clock speed: 1.83 GHz vs 1.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
| Number of cores | 4 vs 2 |
| Number of threads | 4 vs 2 |
| Maximum frequency | 1.83 GHz vs 1.5 GHz |
| Manufacturing process technology | 22 nm vs 32 nm |
Reasons to consider the Intel Celeron 887
- Around 11% higher maximum core temperature: 100 °C vs 90°C
- 4x more maximum memory size: 16 GB vs 4 GB
- Around 47% better performance in PassMark - Single thread mark: 700 vs 476
- Around 11% better performance in PassMark - CPU mark: 764 vs 690
| Specifications (specs) | |
| Maximum core temperature | 100 °C vs 90°C |
| Maximum memory size | 16 GB vs 4 GB |
| Benchmarks | |
| PassMark - Single thread mark | 700 vs 476 |
| PassMark - CPU mark | 764 vs 690 |
Compare benchmarks
CPU 1: Intel Atom Z3560
CPU 2: Intel Celeron 887
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Atom Z3560 | Intel Celeron 887 |
|---|---|---|
| PassMark - Single thread mark | 476 | 700 |
| PassMark - CPU mark | 690 | 764 |
| Geekbench 4 - Single Core | 224 | |
| Geekbench 4 - Multi-Core | 410 |
Compare specifications (specs)
| Intel Atom Z3560 | Intel Celeron 887 | |
|---|---|---|
Essentials |
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| Architecture codename | Moorefield | Sandy Bridge |
| Launch date | Q2'14 | 1 October 2012 |
| Place in performance rating | 3028 | 3030 |
| Processor Number | Z3560 | 887 |
| Series | Intel® Atom™ Processor Z Series | Legacy Intel® Celeron® Processor |
| Status | Launched | Launched |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $86 | |
Performance |
||
| 64 bit support | ||
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 90°C | 100 °C |
| Maximum frequency | 1.83 GHz | 1.5 GHz |
| Number of cores | 4 | 2 |
| Number of threads | 4 | 2 |
| VID voltage range | AVID | |
| Base frequency | 1.50 GHz | |
| Bus Speed | 5 GT/s DMI | |
| Die size | 131 mm | |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | |
| L3 cache | 2048 KB | |
| Transistor count | 504 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 12.8 GB/s | 21.3 GB/s |
| Maximum memory size | 4 GB | 16 GB |
| Supported memory types | LPDDR3 1600 | DDR3 1066/1333 |
Graphics |
||
| Graphics base frequency | 457 MHz | 350 MHz |
| Graphics max frequency | 533 MHz | 1 GHz |
| Graphics max dynamic frequency | 1.00 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| MIPI-DSI | ||
| Number of displays supported | 2 | 2 |
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 14x14mm | 31.0mm x 24.0mm (BGA1023) |
| Sockets supported | FCBGA1023 | |
| Thermal Design Power (TDP) | 17 Watt | |
Peripherals |
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| Number of USB ports | 2 | |
| UART | ||
| USB revision | 2.0/3.0 | |
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Secure Key technology | ||
| Anti-Theft technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| General-Purpose Input/Output (GPIO) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3, Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Physical Address Extensions (PAE) | 32-bit | |
| Smart Idle | ||
| Thermal Monitoring | ||
| 4G WiMAX Wireless | ||
| Flexible Display interface (FDI) | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||