Intel Atom Z540 vs Intel Pentium 4-M 1.90

Comparative analysis of Intel Atom Z540 and Intel Pentium 4-M 1.90 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Atom Z540

  • CPU is newer: launch date 5 year(s) 10 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
  • 8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 16x lower typical power consumption: 2.4 Watt vs 32 Watt
  • Around 50% better performance in PassMark - CPU mark: 348 vs 232
Specifications (specs)
Launch date April 2008 vs June 2002
Manufacturing process technology 45 nm vs 130 nm
L1 cache 64 KB (per core) vs 8 KB
Thermal Design Power (TDP) 2.4 Watt vs 32 Watt
Benchmarks
PassMark - CPU mark 348 vs 232

Reasons to consider the Intel Pentium 4-M 1.90

  • Around 2% higher clock speed: 1.9 GHz vs 1.86 GHz
  • Around 11% higher maximum core temperature: 100°C vs 90°C
Maximum frequency 1.9 GHz vs 1.86 GHz
Maximum core temperature 100°C vs 90°C

Compare benchmarks

CPU 1: Intel Atom Z540
CPU 2: Intel Pentium 4-M 1.90

PassMark - CPU mark
CPU 1
CPU 2
348
232
Name Intel Atom Z540 Intel Pentium 4-M 1.90
PassMark - Single thread mark 0 0
PassMark - CPU mark 348 232

Compare specifications (specs)

Intel Atom Z540 Intel Pentium 4-M 1.90

Essentials

Architecture codename Silverthorne Northwood
Launch date April 2008 June 2002
Place in performance rating 3339 3350
Processor Number Z540
Series Legacy Intel Atom® Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

Base frequency 1.86 GHz 1.90 GHz
Bus Speed 533 MHz FSB 400 MHz FSB
Die size 26 mm2 131 mm2
L1 cache 64 KB (per core) 8 KB
L2 cache 512 KB (per core) 512 KB
Manufacturing process technology 45 nm 130 nm
Maximum core temperature 90°C 100°C
Maximum frequency 1.86 GHz 1.9 GHz
Number of cores 1 1
Transistor count 47 million 55 million
VID voltage range 0.75 -1.1V 1.3V
64 bit support
Maximum case temperature (TCase) 100 °C

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 13mm x 14mm 35mm x 35mm
Scenario Design Power (SDP) 0.96 W
Sockets supported PBGA441 PPGA478
Thermal Design Power (TDP) 2.4 Watt 32 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Instruction set extensions Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

Supported memory types DDR1, DDR2

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