Intel Atom Z540 vs Intel Pentium 4-M 2.50
Comparative analysis of Intel Atom Z540 and Intel Pentium 4-M 2.50 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Atom Z540
- CPU is newer: launch date 5 year(s) 0 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
- 8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 17.5x lower typical power consumption: 2.4 Watt vs 35 Watt
- Around 36% better performance in PassMark - CPU mark: 348 vs 256
Specifications (specs) | |
Launch date | April 2008 vs April 2003 |
Manufacturing process technology | 45 nm vs 130 nm |
L1 cache | 64 KB (per core) vs 8 KB |
Thermal Design Power (TDP) | 2.4 Watt vs 35 Watt |
Benchmarks | |
PassMark - CPU mark | 348 vs 256 |
Reasons to consider the Intel Pentium 4-M 2.50
- Around 34% higher clock speed: 2.5 GHz vs 1.86 GHz
- Around 11% higher maximum core temperature: 100°C vs 90°C
Maximum frequency | 2.5 GHz vs 1.86 GHz |
Maximum core temperature | 100°C vs 90°C |
Compare benchmarks
CPU 1: Intel Atom Z540
CPU 2: Intel Pentium 4-M 2.50
PassMark - CPU mark |
|
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Name | Intel Atom Z540 | Intel Pentium 4-M 2.50 |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 348 | 256 |
Compare specifications (specs)
Intel Atom Z540 | Intel Pentium 4-M 2.50 | |
---|---|---|
Essentials |
||
Architecture codename | Silverthorne | Northwood |
Launch date | April 2008 | April 2003 |
Place in performance rating | 3339 | 3347 |
Processor Number | Z540 | |
Series | Legacy Intel Atom® Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
Base frequency | 1.86 GHz | 2.50 GHz |
Bus Speed | 533 MHz FSB | 400 MHz FSB |
Die size | 26 mm2 | 131 mm2 |
L1 cache | 64 KB (per core) | 8 KB |
L2 cache | 512 KB (per core) | 512 KB |
Manufacturing process technology | 45 nm | 130 nm |
Maximum core temperature | 90°C | 100°C |
Maximum frequency | 1.86 GHz | 2.5 GHz |
Number of cores | 1 | 1 |
Transistor count | 47 million | 55 million |
VID voltage range | 0.75 -1.1V | 1.3V |
64 bit support | ||
Maximum case temperature (TCase) | 100 °C | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 13mm x 14mm | 35mm x 35mm |
Scenario Design Power (SDP) | 0.96 W | |
Sockets supported | PBGA441 | PPGA478 |
Thermal Design Power (TDP) | 2.4 Watt | 35 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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Supported memory types | DDR1, DDR2 |