Intel Celeron 2.10 vs Intel Pentium III 1200
Comparative analysis of Intel Celeron 2.10 and Intel Pentium III 1200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron 2.10
- CPU is newer: launch date 1 year(s) 4 month(s) later
- Around 75% higher clock speed: 2.1 GHz vs 1.2 GHz
Launch date | November 2002 vs July 2001 |
Maximum frequency | 2.1 GHz vs 1.2 GHz |
Reasons to consider the Intel Pentium III 1200
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 87% lower typical power consumption: 29.9 Watt vs 55.5 Watt
- Around 14% better performance in PassMark - CPU mark: 278 vs 244
Specifications (specs) | |
L2 cache | 256 KB vs 128 KB |
Thermal Design Power (TDP) | 29.9 Watt vs 55.5 Watt |
Benchmarks | |
PassMark - CPU mark | 278 vs 244 |
Compare benchmarks
CPU 1: Intel Celeron 2.10
CPU 2: Intel Pentium III 1200
PassMark - CPU mark |
|
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Name | Intel Celeron 2.10 | Intel Pentium III 1200 |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 244 | 278 |
Compare specifications (specs)
Intel Celeron 2.10 | Intel Pentium III 1200 | |
---|---|---|
Essentials |
||
Architecture codename | Northwood | Tualatin |
Launch date | November 2002 | July 2001 |
Place in performance rating | 3348 | 3354 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 2.10 GHz | 1.20 GHz |
Bus Speed | 400 MHz FSB | 133 MHz FSB |
Die size | 131 mm2 | 80 mm2 |
L1 cache | 8 KB | 8 KB |
L2 cache | 128 KB | 256 KB |
Manufacturing process technology | 130 nm | 130 nm |
Maximum core temperature | 69°C | 69°C |
Maximum frequency | 2.1 GHz | 1.2 GHz |
Number of cores | 1 | 1 |
Transistor count | 55 million | 44 million |
VID voltage range | 1.315V-1.525V | 1.5V |
Maximum case temperature (TCase) | 69 °C | |
Memory |
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Supported memory types | DDR1, DDR2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 35mm | |
Sockets supported | PPGA478 | PPGA370 |
Thermal Design Power (TDP) | 55.5 Watt | 29.9 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) |