Intel Celeron 2.10 vs Intel Pentium III 1000

Comparative analysis of Intel Celeron 2.10 and Intel Pentium III 1000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 2.10

Intel Pentium III 1000

Differences

Reasons to consider the Intel Celeron 2.10

Around 110% higher clock speed: 2.1 GHz vs 1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 130 nm vs 180 nm

Maximum frequency	2.1 GHz vs 1 GHz
Manufacturing process technology	130 nm vs 180 nm

Reasons to consider the Intel Pentium III 1000

Around 9% higher maximum core temperature: 75°C vs 69°C
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 93% lower typical power consumption: 29 Watt vs 55.5 Watt

Specifications (specs)
Maximum core temperature	75°C vs 69°C
L2 cache	256 KB vs 128 KB
Thermal Design Power (TDP)	29 Watt vs 55.5 Watt
Benchmarks
PassMark - CPU mark	245 vs 244

Compare benchmarks

CPU 1: Intel Celeron 2.10
CPU 2: Intel Pentium III 1000

PassMark - CPU mark

CPU 1

CPU 2

244

245

Name	Intel Celeron 2.10	Intel Pentium III 1000
PassMark - Single thread mark	0	0
PassMark - CPU mark	244	245

Compare specifications (specs)

	Intel Celeron 2.10	Intel Pentium III 1000
Essentials
Architecture codename	Northwood	Coppermine
Launch date	November 2002	Q1'00
Place in performance rating	3348	3352
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.10 GHz	1.00 GHz
Bus Speed	400 MHz FSB	133 MHz FSB
Die size	131 mm2	80 mm
L1 cache	8 KB	8 KB
L2 cache	128 KB	256 KB
Manufacturing process technology	130 nm	180 nm
Maximum core temperature	69°C	75°C
Maximum frequency	2.1 GHz	1 GHz
Number of cores	1	1
Transistor count	55 million	44 million
VID voltage range	1.315V-1.525V	1.75V
Maximum case temperature (TCase)		69 °C
Memory
Supported memory types	DDR1, DDR2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	35mm x 35mm
Sockets supported	PPGA478	PPGA370, SECC2, SECC2495
Thermal Design Power (TDP)	55.5 Watt	29 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Virtualization
Intel® Virtualization Technology (VT-x)