Intel Celeron 2000E vs AMD Ryzen 3 3200U

Comparative analysis of Intel Celeron 2000E and AMD Ryzen 3 3200U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Ryzen 3 3200U

  • 2 more threads: 4 vs 2
  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 2.5x lower typical power consumption: 15 Watt vs 37 Watt
  • Around 41% better performance in PassMark - Single thread mark: 1804 vs 1282
  • 2.4x better performance in PassMark - CPU mark: 3786 vs 1607
Specifications (specs)
Number of threads 4 vs 2
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 15 Watt vs 37 Watt
Benchmarks
PassMark - Single thread mark 1804 vs 1282
PassMark - CPU mark 3786 vs 1607

Compare benchmarks

CPU 1: Intel Celeron 2000E
CPU 2: AMD Ryzen 3 3200U

PassMark - Single thread mark
CPU 1
CPU 2
1282
1804
PassMark - CPU mark
CPU 1
CPU 2
1607
3786
Name Intel Celeron 2000E AMD Ryzen 3 3200U
PassMark - Single thread mark 1282 1804
PassMark - CPU mark 1607 3786
Geekbench 4 - Single Core 670
Geekbench 4 - Multi-Core 1439

Compare specifications (specs)

Intel Celeron 2000E AMD Ryzen 3 3200U

Essentials

Architecture codename Haswell
Launch date Q1'14
Place in performance rating 1947 1930
Processor Number 2000E
Series Intel® Celeron® Processor 2000 Series AMD Ryzen 3 Mobile Processors with Radeon Vega Graphics
Status Launched
Vertical segment Embedded Laptop
Family AMD Ryzen Processors
OPN Tray YM3200C4T2OFG

Performance

64 bit support
Base frequency 2.20 GHz 2.6 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm 14 nm
Maximum core temperature 100°C 105°C
Number of cores 2 2
Number of threads 2 4
Compute Cores 5
L1 cache 192 KB
L2 cache 1 MB
L3 cache 4 MB
Maximum frequency 3.5 GHz
Number of GPU cores 3
Unlocked

Memory

Max memory channels 2 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3L 1333/1600
Supported memory frequency 2400 MHz

Graphics

Graphics base frequency 400 MHz
Graphics max dynamic frequency 900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory 1 GB
Processor graphics Intel HD Graphics Radeon Vega 3 Graphics
Graphics max frequency 1200 MHz
iGPU core count 3

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 32mm x 1.6mm
Sockets supported FCBGA1364 FP5
Thermal Design Power (TDP) 37 Watt 15 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16 or 2x8 or 1x8 2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
AMD SenseMI
FreeSync
The "Zen" Core Architecture

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics API support

DirectX 12