Intel Celeron 550 vs Intel Pentium 4 519K
Comparative analysis of Intel Celeron 550 and Intel Pentium 4 519K processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 550
- Around 48% higher maximum core temperature: 100°C vs 67.7°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 2.7x lower typical power consumption: 31 Watt vs 84 Watt
- Around 44% better performance in Geekbench 4 - Single Core: 955 vs 662
- Around 38% better performance in Geekbench 4 - Multi-Core: 918 vs 665
Specifications (specs) | |
Maximum core temperature | 100°C vs 67.7°C |
Manufacturing process technology | 65 nm vs 90 nm |
Thermal Design Power (TDP) | 31 Watt vs 84 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 955 vs 662 |
Geekbench 4 - Multi-Core | 918 vs 665 |
Reasons to consider the Intel Pentium 4 519K
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
Unlocked | Unlocked vs Locked |
Compare benchmarks
CPU 1: Intel Celeron 550
CPU 2: Intel Pentium 4 519K
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Celeron 550 | Intel Pentium 4 519K |
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PassMark - Single thread mark | 662 | |
PassMark - CPU mark | 334 | |
Geekbench 4 - Single Core | 955 | 662 |
Geekbench 4 - Multi-Core | 918 | 665 |
Compare specifications (specs)
Intel Celeron 550 | Intel Pentium 4 519K | |
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Essentials |
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Architecture codename | Merom | Prescott |
Launch date | Q3'06 | January 2005 |
Place in performance rating | 2554 | 2758 |
Processor Number | 550 | 519K |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 3.06 GHz |
Bus Speed | 533 MHz FSB | 533 MHz FSB |
Die size | 143 mm2 | 112 mm2 |
Manufacturing process technology | 65 nm | 90 nm |
Maximum core temperature | 100°C | 67.7°C |
Number of cores | 1 | 1 |
Transistor count | 291 million | 125 million |
VID voltage range | 0.95V-1.30V | 1.25V-1.400V |
L1 cache | 16 KB | |
L2 cache | 1024 KB | |
Maximum frequency | 3.06 GHz | |
Unlocked | ||
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | |
Sockets supported | PPGA478, PBGA479 | PLGA775 |
Thermal Design Power (TDP) | 31 Watt | 84 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2, DDR3 |