Intel Celeron 847E vs AMD A6 Pro-7050B
Comparative analysis of Intel Celeron 847E and AMD A6 Pro-7050B processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 847E
- 5.9x lower typical power consumption: 17 Watt vs 100 Watt
| Thermal Design Power (TDP) | 17 Watt vs 100 Watt |
Reasons to consider the AMD A6 Pro-7050B
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
- Around 67% better performance in PassMark - Single thread mark: 866 vs 520
- Around 73% better performance in PassMark - CPU mark: 1010 vs 584
| Specifications (specs) | |
| Manufacturing process technology | 28 nm vs 32 nm |
| Benchmarks | |
| PassMark - Single thread mark | 866 vs 520 |
| PassMark - CPU mark | 1010 vs 584 |
Compare benchmarks
CPU 1: Intel Celeron 847E
CPU 2: AMD A6 Pro-7050B
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron 847E | AMD A6 Pro-7050B |
|---|---|---|
| PassMark - Single thread mark | 520 | 866 |
| PassMark - CPU mark | 584 | 1010 |
| Geekbench 4 - Single Core | 1116 | |
| Geekbench 4 - Multi-Core | 1572 |
Compare specifications (specs)
| Intel Celeron 847E | AMD A6 Pro-7050B | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Kaveri |
| Launch date | Q2'11 | 4 June 2014 |
| Place in performance rating | 2474 | 2467 |
| Processor Number | 847E | |
| Series | Legacy Intel® Celeron® Processor | AMD PRO A-Series A6 APU for Laptops |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
| Family | AMD PRO A-Series Processors | |
| OPN Tray | AM705BECH23JA | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 2.2 GHz |
| Manufacturing process technology | 32 nm | 28 nm |
| Maximum core temperature | 100 | |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| Compute Cores | 5 | |
| Die size | 245 mm | |
| L2 cache | 1 MB | |
| Maximum frequency | 3 GHz | |
| Number of GPU cores | 3 | |
| Transistor count | 2410 Million | |
| Unlocked | ||
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16.6 GB | |
| Supported memory types | DDR3 1066/1333 | DDR3 / DDR3L-1600 |
| Supported memory frequency | 1600 MHz | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 800 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | AMD Radeon R4 Graphics |
| Enduro | ||
| Graphics max frequency | 533 MHz | |
| iGPU core count | 192 | |
| Number of pipelines | 192 | |
| Switchable graphics | ||
| Unified Video Decoder (UVD) | ||
| Video Codec Engine (VCE) | ||
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 31mm x 24mm (FCBGA1023) | |
| Sockets supported | FCBGA1023 | FP3 |
| Thermal Design Power (TDP) | 17 Watt | 100 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | 3.0 |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| AMD App Acceleration | ||
| AMD Elite Experiences | ||
| AMD HD3D technology | ||
| AMD Mantle API | ||
| Enhanced Virus Protection (EVP) | ||
| Frame Rate Target Control (FRTC) | ||
| Fused Multiply-Add (FMA) | ||
| Fused Multiply-Add 4 (FMA4) | ||
| Heterogeneous System Architecture (HSA) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Out-of-band client management | ||
| PowerGating | ||
| PowerNow | ||
| RAID | ||
| System Image Stability | ||
| TrueAudio | ||
| VirusProtect | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| AMD Virtualization (AMD-V™) | ||
| IOMMU 2.0 | ||
Graphics API support |
||
| DirectX | 12 | |
| Vulkan | ||