Intel Celeron 847E vs Intel Core i7-620UM
Comparative analysis of Intel Celeron 847E and Intel Core i7-620UM processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 847E
- 2.1x more maximum memory size: 16.6 GB vs 8 GB
- Around 6% lower typical power consumption: 17 Watt vs 18 Watt
| Maximum memory size | 16.6 GB vs 8 GB |
| Thermal Design Power (TDP) | 17 Watt vs 18 Watt |
Reasons to consider the Intel Core i7-620UM
- 2 more threads: 4 vs 2
- Around 5% higher maximum core temperature: 105°C vs 100
- Around 65% better performance in PassMark - Single thread mark: 859 vs 520
- Around 87% better performance in PassMark - CPU mark: 1091 vs 584
| Specifications (specs) | |
| Number of threads | 4 vs 2 |
| Maximum core temperature | 105°C vs 100 |
| Benchmarks | |
| PassMark - Single thread mark | 859 vs 520 |
| PassMark - CPU mark | 1091 vs 584 |
Compare benchmarks
CPU 1: Intel Celeron 847E
CPU 2: Intel Core i7-620UM
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron 847E | Intel Core i7-620UM |
|---|---|---|
| PassMark - Single thread mark | 520 | 859 |
| PassMark - CPU mark | 584 | 1091 |
| Geekbench 4 - Single Core | 1116 | |
| Geekbench 4 - Multi-Core | 1572 |
Compare specifications (specs)
| Intel Celeron 847E | Intel Core i7-620UM | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Arrandale |
| Launch date | Q2'11 | 4 January 2010 |
| Place in performance rating | 2474 | 2471 |
| Processor Number | 847E | i7-620UM |
| Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Embedded | Mobile |
| Launch price (MSRP) | $278 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 1.06 GHz |
| Manufacturing process technology | 32 nm | 32 nm |
| Maximum core temperature | 100 | 105°C |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 4 |
| Bus Speed | 2.5 GT/s DMI | |
| Die size | 81 mm2 | |
| Front-side bus (FSB) | 2500 MHz | |
| L2 cache | 512 KB | |
| L3 cache | 4096 KB | |
| Maximum frequency | 2.13 GHz | |
| Transistor count | 382 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 21.3 GB/s | 12.8 GB/s |
| Maximum memory size | 16.6 GB | 8 GB |
| Supported memory types | DDR3 1066/1333 | DDR3 800 |
Graphics |
||
| Graphics base frequency | 350 MHz | 166 MHz |
| Graphics max dynamic frequency | 800 MHz | 500 MHz |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | Intel HD Graphics |
| Graphics max frequency | 500 MHz | |
| Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | 2 |
| SDVO | ||
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 31mm x 24mm (FCBGA1023) | BGA 34mm x 28mm |
| Sockets supported | FCBGA1023 | BGA1288 |
| Thermal Design Power (TDP) | 17 Watt | 18 Watt |
| Max number of CPUs in a configuration | 1 | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 2.0 | 2.0 |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | 1x16 |
Security & Reliability |
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| Anti-Theft technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Execute Disable Bit (EDB) | ||
Advanced Technologies |
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| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
