Intel Celeron D 325 vs Intel Pentium III 1000S

Comparative analysis of Intel Celeron D 325 and Intel Pentium III 1000S processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

Intel Celeron D 325

Intel Pentium III 1000S

Differences

Reasons to consider the Intel Celeron D 325

CPU is newer: launch date 3 year(s) 0 month(s) later
Around 153% higher clock speed: 2.53 GHz vs 1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later

Launch date	June 2004 vs June 2001
Maximum frequency	2.53 GHz vs 1 GHz
Manufacturing process technology	90 nm vs 130 nm
L1 cache	16 KB vs 8 KB

Reasons to consider the Intel Pentium III 1000S

Around 49% higher maximum core temperature: 100°C vs 67°C
2x more L2 cache, more data can be stored in the L2 cache for quick access later
6.1x lower typical power consumption: 12.1 Watt vs 73 Watt

Maximum core temperature	100°C vs 67°C
L2 cache	512 KB vs 256 KB
Thermal Design Power (TDP)	12.1 Watt vs 73 Watt

Compare specifications (specs)

	Intel Celeron D 325	Intel Pentium III 1000S
Essentials
Architecture codename	Prescott	Tualatin
Launch date	June 2004	June 2001
Place in performance rating	not rated	not rated
Processor Number	325
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Server
Performance
Base frequency	2.53 GHz	1.00 GHz
Bus Speed	533 MHz FSB	133 MHz FSB
Die size	112 mm2	80 mm
L1 cache	16 KB	8 KB
L2 cache	256 KB	512 KB
Manufacturing process technology	90 nm	130 nm
Maximum core temperature	67°C	100°C
Maximum frequency	2.53 GHz	1 GHz
Number of cores	1	1
Transistor count	125 million	44 million
VID voltage range	1.250V-1.400V	1.15V
64 bit support
Maximum case temperature (TCase)		69 °C
Memory
Supported memory types	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	35mm x 35mm
Sockets supported	PPGA478	H-PBGA479
Thermal Design Power (TDP)	73 Watt	12.1 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Virtualization
Intel® Virtualization Technology (VT-x)