Intel Celeron D 346 vs Intel Pentium 4 HT EE 3.46

Comparative analysis of Intel Celeron D 346 and Intel Pentium 4 HT EE 3.46 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

Intel Celeron D 346

Intel Pentium 4 HT EE 3.46

Differences

Reasons to consider the Intel Celeron D 346

Around 3% higher maximum core temperature: 67.7°C vs 66°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 32% lower typical power consumption: 84 Watt vs 110.7 Watt

Maximum core temperature	67.7°C vs 66°C
Manufacturing process technology	90 nm vs 130 nm
L1 cache	16 KB vs 8 KB
Thermal Design Power (TDP)	84 Watt vs 110.7 Watt

Reasons to consider the Intel Pentium 4 HT EE 3.46

Around 13% higher clock speed: 3.46 GHz vs 3.06 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.46 GHz vs 3.06 GHz
L2 cache	512 KB vs 256 KB

Compare specifications (specs)

	Intel Celeron D 346	Intel Pentium 4 HT EE 3.46
Essentials
Architecture codename	Prescott	Northwood
Launch date	October 2004	October 2004
Place in performance rating	not rated	not rated
Processor Number	346
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.06 GHz	3.46 GHz
Bus Speed	533 MHz FSB	1066 MHz FSB
Die size	112 mm2	237 mm
L1 cache	16 KB	8 KB
L2 cache	256 KB	512 KB
Manufacturing process technology	90 nm	130 nm
Maximum core temperature	67.7°C	66°C
Maximum frequency	3.06 GHz	3.46 GHz
Number of cores	1	1
Transistor count	125 million	178 million
VID voltage range	1.250V-1.400V	1.287V-1.4V
L3 cache		2048 KB
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	PLGA775	PLGA775, LGA775
Thermal Design Power (TDP)	84 Watt	110.7 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)