Intel Celeron D 346 vs Intel Pentium M 765
Comparative analysis of Intel Celeron D 346 and Intel Pentium M 765 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Celeron D 346
- Around 46% higher clock speed: 3.06 GHz vs 2.1 GHz
| Maximum frequency | 3.06 GHz vs 2.1 GHz |
Reasons to consider the Intel Pentium M 765
- Around 48% higher maximum core temperature: 100°C vs 67.7°C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 10.5x lower typical power consumption: 7.5 Watt vs 84 Watt
| Maximum core temperature | 100°C vs 67.7°C |
| L1 cache | 32 KB vs 16 KB |
| L2 cache | 2048 KB vs 256 KB |
| Thermal Design Power (TDP) | 7.5 Watt vs 84 Watt |
Compare specifications (specs)
| Intel Celeron D 346 | Intel Pentium M 765 | |
|---|---|---|
Essentials |
||
| Architecture codename | Prescott | Dothan |
| Launch date | October 2004 | October 2004 |
| Place in performance rating | not rated | not rated |
| Processor Number | 346 | 765 |
| Series | Legacy Intel® Celeron® Processor | Legacy Intel® Pentium® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.06 GHz | 2.10 GHz |
| Bus Speed | 533 MHz FSB | 400 MHz FSB |
| Die size | 112 mm2 | 87 mm2 |
| L1 cache | 16 KB | 32 KB |
| L2 cache | 256 KB | 2048 KB |
| Manufacturing process technology | 90 nm | 90 nm |
| Maximum core temperature | 67.7°C | 100°C |
| Maximum frequency | 3.06 GHz | 2.1 GHz |
| Number of cores | 1 | 1 |
| Transistor count | 125 million | 144 million |
| VID voltage range | 1.250V-1.400V | 0.988-1.356V |
| Front-side bus (FSB) | 400 MHz | |
| Number of threads | 1 | |
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
| Sockets supported | PLGA775 | PPGA478, H-PBGA479 |
| Thermal Design Power (TDP) | 84 Watt | 7.5 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | 32-bit |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
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