Intel Celeron G3900E vs Intel Core i3-4100M
Comparative analysis of Intel Celeron G3900E and Intel Core i3-4100M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Celeron G3900E
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 6% lower typical power consumption: 35 Watt vs 37 Watt
- Around 7% better performance in PassMark - Single thread mark: 1499 vs 1403
Specifications (specs) | |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 64 GB vs 32 GB |
Thermal Design Power (TDP) | 35 Watt vs 37 Watt |
Benchmarks | |
PassMark - Single thread mark | 1499 vs 1403 |
Reasons to consider the Intel Core i3-4100M
- 2 more threads: 4 vs 2
- Around 24% better performance in PassMark - CPU mark: 2532 vs 2034
Specifications (specs) | |
Number of threads | 4 vs 2 |
Benchmarks | |
PassMark - CPU mark | 2532 vs 2034 |
Compare benchmarks
CPU 1: Intel Celeron G3900E
CPU 2: Intel Core i3-4100M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G3900E | Intel Core i3-4100M |
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PassMark - Single thread mark | 1499 | 1403 |
PassMark - CPU mark | 2034 | 2532 |
Geekbench 4 - Single Core | 535 | |
Geekbench 4 - Multi-Core | 1152 | |
GFXBench 4.0 - T-Rex (Frames) | 3389 | |
GFXBench 4.0 - T-Rex (Fps) | 3389 |
Compare specifications (specs)
Intel Celeron G3900E | Intel Core i3-4100M | |
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Essentials |
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Architecture codename | Skylake | Haswell |
Launch date | Q1'16 | 4 June 2013 |
Place in performance rating | 1723 | 1726 |
Processor Number | G3900E | i3-4100M |
Series | Intel® Celeron® Processor G Series | 4th Generation Intel® Core™ i3 Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $225 | |
Price now | $218.57 | |
Value for money (0-100) | 4.69 | |
Performance |
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64 bit support | ||
Base frequency | 2.40 GHz | 2.50 GHz |
Bus Speed | 8 GT/s DMI3 | 5 GT/s DMI2 |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 100°C | 100°C |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Die size | 130 mm | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 3072 KB | |
Maximum frequency | 2.5 GHz | |
Transistor count | 960 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 25.6 GB/s |
Maximum memory size | 64 GB | 32 GB |
Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | DDR3L 1333/1600 |
Graphics |
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Device ID | 0x1902 | 0x416 |
Graphics base frequency | 350 MHz | 400 MHz |
Graphics max dynamic frequency | 950 MHz | 1.10 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | 2 GB |
Processor graphics | Intel® HD Graphics 510 | Intel® HD Graphics 4600 |
Graphics max frequency | 1.1 GHz | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | 3840x2160@60Hz |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | 3840x2160@60Hz |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 12 | 11.2/12 |
OpenGL | 4.4 | 4.3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 37.5mm x 37.5mm x 4.7mm |
Sockets supported | FCBGA1440 | FCPGA946 |
Thermal Design Power (TDP) | 35 Watt | 37 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 or 2x8 or 1x8 2x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |