Intel Celeron G3900TE vs Intel Core i3-8121U
Comparative analysis of Intel Celeron G3900TE and Intel Core i3-8121U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-8121U
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 39% better performance in PassMark - Single thread mark: 1944 vs 1402
- 2.4x better performance in PassMark - CPU mark: 4391 vs 1850
| Specifications (specs) | |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 10 nm vs 14 nm |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1944 vs 1402 |
| PassMark - CPU mark | 4391 vs 1850 |
Compare benchmarks
CPU 1: Intel Celeron G3900TE
CPU 2: Intel Core i3-8121U
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron G3900TE | Intel Core i3-8121U |
|---|---|---|
| PassMark - Single thread mark | 1402 | 1944 |
| PassMark - CPU mark | 1850 | 4391 |
| Geekbench 4 - Single Core | 829 | |
| Geekbench 4 - Multi-Core | 1948 |
Compare specifications (specs)
| Intel Celeron G3900TE | Intel Core i3-8121U | |
|---|---|---|
Essentials |
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| Architecture codename | Skylake | Cannon-Lake 2+0 |
| Launch date | Q4'15 | 2 April 2018 |
| Place in performance rating | 1820 | 1740 |
| Processor Number | G3900TE | |
| Series | Intel® Celeron® Processor G Series | Intel Core i3 |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
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| 64 bit support | ||
| Base frequency | 2.30 GHz | |
| Bus Speed | 8 GT/s DMI3 | |
| Manufacturing process technology | 14 nm | 10 nm |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 4 |
| Die size | 123 mm | |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | |
| L3 cache | 4 MB | |
| Maximum case temperature (TCase) | 72 °C | |
| Maximum frequency | 3.1 GHz | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 64 GB | |
| Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | DDR4 |
Graphics |
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| Device ID | 0x1902 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 950 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel® HD Graphics 510 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.4 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1151 | |
| Thermal Design Power (TDP) | 35 Watt | 15 Watt |
| Thermal Solution | PCG 2015A (35W) | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||

