Apple A11 Bionic vs Intel Celeron G3900TE
Comparative analysis of Apple A11 Bionic and Intel Celeron G3900TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Apple A11 Bionic
- 4 more cores, run more applications at once: 6 vs 2
- 4 more threads: 6 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- 4.4x lower typical power consumption: 8 Watt vs 35 Watt
- 2.4x better performance in PassMark - CPU mark: 4419 vs 1850
Specifications (specs) | |
Number of cores | 6 vs 2 |
Number of threads | 6 vs 2 |
Manufacturing process technology | 10 nm vs 14 nm |
Thermal Design Power (TDP) | 8 Watt vs 35 Watt |
Benchmarks | |
PassMark - CPU mark | 4419 vs 1850 |
Reasons to consider the Intel Celeron G3900TE
- 21.3x more maximum memory size: 64 GB vs 3 GB
- Around 6% better performance in PassMark - Single thread mark: 1402 vs 1324
Specifications (specs) | |
Maximum memory size | 64 GB vs 3 GB |
Benchmarks | |
PassMark - Single thread mark | 1402 vs 1324 |
Compare benchmarks
CPU 1: Apple A11 Bionic
CPU 2: Intel Celeron G3900TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Apple A11 Bionic | Intel Celeron G3900TE |
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PassMark - Single thread mark | 1324 | 1402 |
PassMark - CPU mark | 4419 | 1850 |
Compare specifications (specs)
Apple A11 Bionic | Intel Celeron G3900TE | |
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Essentials |
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Architecture codename | Monsoon/Mistral | Skylake |
Launch date | 22 Sep 2017 | Q4'15 |
OS Support | iOS 11.0, iOS 16.4.1, iPadOS 16.4.1, tvOS 16.2 | |
Place in performance rating | 1818 | 1819 |
Processor Number | APL1W72 | G3900TE |
Vertical segment | Mobile | Embedded |
Series | Intel® Celeron® Processor G Series | |
Status | Launched | |
Performance |
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Base frequency | 1.19 GHz | 2.30 GHz |
L1 cache | 64 KB instruction + 64 KB data (per core) | |
L2 cache | 8 MB (shared) | |
Manufacturing process technology | 10 nm | 14 nm |
Maximum frequency | 2.39 GHz | |
Number of cores | 6 | 2 |
Number of threads | 6 | 2 |
Transistor count | 4.3 billion | |
64 bit support | ||
Bus Speed | 8 GT/s DMI3 | |
Memory |
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Max memory channels | 1 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 34.1 GB/s |
Maximum memory size | 3 GB | 64 GB |
Supported memory types | LPDDR4X-4266 | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
Graphics |
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Execution Units | 12 | |
Graphics base frequency | 1066 MHz | 350 MHz |
iGPU core count | 3 | |
Device ID | 0x1902 | |
Graphics max dynamic frequency | 950 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 510 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Thermal Design Power (TDP) | 8 Watt | 35 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1151 | |
Thermal Solution | PCG 2015A (35W) | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.4 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |