Intel Celeron G3900TE vs Intel Core 2 Duo P9500
Comparative analysis of Intel Celeron G3900TE and Intel Core 2 Duo P9500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron G3900TE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 33% better performance in PassMark - Single thread mark: 1402 vs 1057
- Around 86% better performance in PassMark - CPU mark: 1850 vs 993
Specifications (specs) | |
Manufacturing process technology | 14 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 1402 vs 1057 |
PassMark - CPU mark | 1850 vs 993 |
Reasons to consider the Intel Core 2 Duo P9500
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Celeron G3900TE
CPU 2: Intel Core 2 Duo P9500
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G3900TE | Intel Core 2 Duo P9500 |
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PassMark - Single thread mark | 1402 | 1057 |
PassMark - CPU mark | 1850 | 993 |
Geekbench 4 - Single Core | 1619 | |
Geekbench 4 - Multi-Core | 2630 |
Compare specifications (specs)
Intel Celeron G3900TE | Intel Core 2 Duo P9500 | |
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Essentials |
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Architecture codename | Skylake | Penryn |
Launch date | Q4'15 | 15 July 2008 |
Place in performance rating | 1819 | 1830 |
Processor Number | G3900TE | P9500 |
Series | Intel® Celeron® Processor G Series | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $348 | |
Price now | $998.99 | |
Value for money (0-100) | 0.52 | |
Performance |
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64 bit support | ||
Base frequency | 2.30 GHz | 2.53 GHz |
Bus Speed | 8 GT/s DMI3 | 1066 MHz FSB |
Manufacturing process technology | 14 nm | 45 nm |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Die size | 107 mm2 | |
Front-side bus (FSB) | 1066 MHz | |
L1 cache | 128 KB | |
L2 cache | 6134 KB | |
Maximum core temperature | 105°C | |
Maximum frequency | 2.53 GHz | |
Transistor count | 410 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 34.1 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | |
Graphics |
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Device ID | 0x1902 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 950 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 510 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.4 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
Sockets supported | FCLGA1151 | PGA478, BGA479 |
Thermal Design Power (TDP) | 35 Watt | 25 Watt |
Thermal Solution | PCG 2015A (35W) | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |