Intel Celeron G470 vs AMD Athlon II X2 260
Comparative analysis of Intel Celeron G470 and AMD Athlon II X2 260 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron G470
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Reasons to consider the AMD Athlon II X2 260
- 1 more cores, run more applications at once: 2 vs 1
- Around 50% better performance in PassMark - Single thread mark: 1254 vs 837
- 2.1x better performance in PassMark - CPU mark: 1179 vs 570
Specifications (specs) | |
Number of cores | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1254 vs 837 |
PassMark - CPU mark | 1179 vs 570 |
Compare benchmarks
CPU 1: Intel Celeron G470
CPU 2: AMD Athlon II X2 260
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G470 | AMD Athlon II X2 260 |
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PassMark - Single thread mark | 837 | 1254 |
PassMark - CPU mark | 570 | 1179 |
Geekbench 4 - Single Core | 369 | |
Geekbench 4 - Multi-Core | 651 |
Compare specifications (specs)
Intel Celeron G470 | AMD Athlon II X2 260 | |
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Essentials |
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Architecture codename | Sandy Bridge | Regor |
Launch date | Q2'13 | May 2010 |
Place in performance rating | 2509 | 2522 |
Processor Number | G470 | |
Series | Legacy Intel® Celeron® Processor | |
Status | Launched | |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $48 | |
Price now | $19.99 | |
Value for money (0-100) | 27.59 | |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | |
Bus Speed | 5 GT/s DMI | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 65.5°C | |
Number of cores | 1 | 2 |
Number of threads | 2 | |
Die size | 117 mm | |
L1 cache | 128 KB | |
L2 cache | 1024 KB | |
Maximum frequency | 3.2 GHz | |
Transistor count | 410 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 17 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | DDR3 |
Graphics |
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Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM3 |
Thermal Design Power (TDP) | 35 Watt | 65 Watt |
Peripherals |
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PCI Express revision | 2.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |