Intel Celeron G470 vs AMD Athlon II X2 260

Comparative analysis of Intel Celeron G470 and AMD Athlon II X2 260 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron G470

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 35 Watt vs 65 Watt

Reasons to consider the AMD Athlon II X2 260

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 50% better performance in PassMark - Single thread mark: 1254 vs 837
  • 2.1x better performance in PassMark - CPU mark: 1179 vs 570
Specifications (specs)
Number of cores 2 vs 1
Benchmarks
PassMark - Single thread mark 1254 vs 837
PassMark - CPU mark 1179 vs 570

Compare benchmarks

CPU 1: Intel Celeron G470
CPU 2: AMD Athlon II X2 260

PassMark - Single thread mark
CPU 1
CPU 2
837
1254
PassMark - CPU mark
CPU 1
CPU 2
570
1179
Name Intel Celeron G470 AMD Athlon II X2 260
PassMark - Single thread mark 837 1254
PassMark - CPU mark 570 1179
Geekbench 4 - Single Core 369
Geekbench 4 - Multi-Core 651

Compare specifications (specs)

Intel Celeron G470 AMD Athlon II X2 260

Essentials

Architecture codename Sandy Bridge Regor
Launch date Q2'13 May 2010
Place in performance rating 2509 2522
Processor Number G470
Series Legacy Intel® Celeron® Processor
Status Launched
Vertical segment Desktop Desktop
Launch price (MSRP) $48
Price now $19.99
Value for money (0-100) 27.59

Performance

64 bit support
Base frequency 2.00 GHz
Bus Speed 5 GT/s DMI
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 65.5°C
Number of cores 1 2
Number of threads 2
Die size 117 mm
L1 cache 128 KB
L2 cache 1024 KB
Maximum frequency 3.2 GHz
Transistor count 410 million

Memory

Max memory channels 2
Maximum memory bandwidth 17 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1066/1333 DDR3

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM3
Thermal Design Power (TDP) 35 Watt 65 Watt

Peripherals

PCI Express revision 2.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)