Intel Celeron G470 vs Intel Celeron G1610T

Comparative analysis of Intel Celeron G470 and Intel Celeron G1610T processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron G470

Intel Celeron G1610T

Differences

Reasons to consider the Intel Celeron G1610T

1 more cores, run more applications at once: 2 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 44% better performance in PassMark - Single thread mark: 1207 vs 837
2.3x better performance in PassMark - CPU mark: 1327 vs 570

Specifications (specs)
Number of cores	2 vs 1
Manufacturing process technology	22 nm vs 32 nm
Benchmarks
PassMark - Single thread mark	1207 vs 837
PassMark - CPU mark	1327 vs 570

Compare benchmarks

CPU 1: Intel Celeron G470
CPU 2: Intel Celeron G1610T

PassMark - Single thread mark

CPU 1

CPU 2

837

1207

PassMark - CPU mark

CPU 1

CPU 2

570

1327

Name	Intel Celeron G470	Intel Celeron G1610T
PassMark - Single thread mark	837	1207
PassMark - CPU mark	570	1327
Geekbench 4 - Single Core		410
Geekbench 4 - Multi-Core		741

Compare specifications (specs)

	Intel Celeron G470	Intel Celeron G1610T
Essentials
Architecture codename	Sandy Bridge	Ivy Bridge
Launch date	Q2'13	December 2012
Place in performance rating	2509	2517
Processor Number	G470	G1610T
Series	Legacy Intel® Celeron® Processor	Intel® Celeron® Processor G Series
Status	Launched	Launched
Vertical segment	Desktop	Desktop
Launch price (MSRP)		$89
Price now		$40.04
Value for money (0-100)		16.94
Performance
64 bit support
Base frequency	2.00 GHz	2.30 GHz
Bus Speed	5 GT/s DMI	5 GT/s DMI
Manufacturing process technology	32 nm	22 nm
Maximum core temperature	65.5°C
Number of cores	1	2
Number of threads	2	2
Die size		94 mm
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		2048 KB (shared)
Maximum case temperature (TCase)		65 °C
Maximum frequency		2.3 GHz
Memory
Max memory channels	2	2
Maximum memory bandwidth	17 GB/s	21 GB/s
Maximum memory size	32 GB	32 GB
Supported memory types	DDR3 1066/1333	DDR3 1333
ECC memory support
Graphics
Graphics base frequency	650 MHz	650 MHz
Graphics max dynamic frequency	1.00 GHz	1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics	Intel HD Graphics
Graphics max frequency		1.05 GHz
Graphics interfaces
Number of displays supported	2	3
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	FCLGA1155	FCLGA1155
Thermal Design Power (TDP)	35 Watt	35 Watt
Thermal Solution		2011A
Peripherals
PCI Express revision	2.0	2.0
PCIe configurations		up to 1x16, 2x8, 1x8 & 2x4
Scalability		1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® My WiFi technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)