Intel Celeron J1750 vs Intel Core 2 Duo E4700
Comparative analysis of Intel Celeron J1750 and Intel Core 2 Duo E4700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron J1750
- CPU is newer: launch date 5 year(s) 6 month(s) later
- Around 36% higher maximum core temperature: 100°C vs 73.3°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
- 6.5x lower typical power consumption: 10 Watt vs 65 Watt
| Launch date | 1 September 2013 vs March 2008 |
| Maximum core temperature | 100°C vs 73.3°C |
| Manufacturing process technology | 22 nm vs 65 nm |
| L1 cache | 112 KB vs 64 KB |
| Thermal Design Power (TDP) | 10 Watt vs 65 Watt |
Reasons to consider the Intel Core 2 Duo E4700
- Around 8% higher clock speed: 2.6 GHz vs 2.41 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 48% better performance in PassMark - Single thread mark: 949 vs 642
- Around 67% better performance in PassMark - CPU mark: 900 vs 538
| Specifications (specs) | |
| Maximum frequency | 2.6 GHz vs 2.41 GHz |
| L2 cache | 2048 KB vs 1 MB |
| Benchmarks | |
| PassMark - Single thread mark | 949 vs 642 |
| PassMark - CPU mark | 900 vs 538 |
Compare benchmarks
CPU 1: Intel Celeron J1750
CPU 2: Intel Core 2 Duo E4700
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron J1750 | Intel Core 2 Duo E4700 |
|---|---|---|
| PassMark - Single thread mark | 642 | 949 |
| PassMark - CPU mark | 538 | 900 |
| Geekbench 4 - Single Core | 311 | |
| Geekbench 4 - Multi-Core | 512 |
Compare specifications (specs)
| Intel Celeron J1750 | Intel Core 2 Duo E4700 | |
|---|---|---|
Essentials |
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| Architecture codename | Bay Trail | Conroe |
| Launch date | 1 September 2013 | March 2008 |
| Launch price (MSRP) | $72 | |
| Place in performance rating | 2780 | 2787 |
| Processor Number | J1750 | E4700 |
| Series | Intel® Celeron® Processor J Series | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Desktop | Desktop |
| Price now | $26.99 | |
| Value for money (0-100) | 16.19 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.41 GHz | 2.60 GHz |
| L1 cache | 112 KB | 64 KB |
| L2 cache | 1 MB | 2048 KB |
| Manufacturing process technology | 22 nm | 65 nm |
| Maximum core temperature | 100°C | 73.3°C |
| Maximum frequency | 2.41 GHz | 2.6 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | |
| Bus Speed | 800 MHz FSB | |
| Die size | 111 mm2 | |
| Transistor count | 167 million | |
| VID voltage range | 0.8500V-1.5V | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3L 1333 | DDR1, DDR2, DDR3 |
Graphics |
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| Graphics base frequency | 688 MHz | |
| Graphics max dynamic frequency | 750 MHz | |
| Graphics max frequency | 750 MHz | |
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 25mm X 27mm | 37.5mm x 37.5mm |
| Sockets supported | FCBGA1170 | PLGA775 |
| Thermal Design Power (TDP) | 10 Watt | 65 Watt |
Peripherals |
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| Max number of PCIe lanes | 4 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | X4, X2, X1 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Rapid Storage technology (RST) | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| FSB parity | ||
| Idle States | ||
| Intel® Demand Based Switching | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
