Intel Celeron J1750 processor review
Celeron J1750 processor released by Intel; release date: 1 September 2013. At the time of release, the processor cost $72. The processor is designed for desktop-computers and based on Bay Trail microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.41 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 22 nm. Cache size: L1 - 112 KB, L2 - 1 MB.
Supported memory types: DDR3L 1333. Maximum memory size: 8 GB.
Supported socket types: FCBGA1170. Maximum number of processors in a configuration - 1. Power consumption (TDP): 10 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 750 MHz.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 642 |
| PassMark - CPU mark | 538 |
Specifications (specs)
Essentials |
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| Architecture codename | Bay Trail |
| Launch date | 1 September 2013 |
| Launch price (MSRP) | $72 |
| Place in performance rating | 2780 |
| Processor Number | J1750 |
| Series | Intel® Celeron® Processor J Series |
| Status | Launched |
| Vertical segment | Desktop |
Performance |
|
| 64 bit support | |
| Base frequency | 2.41 GHz |
| L1 cache | 112 KB |
| L2 cache | 1 MB |
| Manufacturing process technology | 22 nm |
| Maximum core temperature | 100°C |
| Maximum frequency | 2.41 GHz |
| Number of cores | 2 |
| Number of threads | 2 |
Memory |
|
| Max memory channels | 2 |
| Maximum memory size | 8 GB |
| Supported memory types | DDR3L 1333 |
Graphics |
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| Graphics base frequency | 688 MHz |
| Graphics max dynamic frequency | 750 MHz |
| Graphics max frequency | 750 MHz |
| Intel® Flexible Display Interface (Intel® FDI) | |
| Intel® InTru™ 3D technology | |
| Intel® Quick Sync Video | |
| Processor graphics | Intel HD Graphics |
Graphics interfaces |
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| Number of displays supported | 2 |
Compatibility |
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| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 25mm X 27mm |
| Sockets supported | FCBGA1170 |
| Thermal Design Power (TDP) | 10 Watt |
Peripherals |
|
| Max number of PCIe lanes | 4 |
| PCI Express revision | 2.0 |
| PCIe configurations | X4, X2, X1 |
Security & Reliability |
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| Anti-Theft technology | |
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Flexible Display interface (FDI) | |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Hyper-Threading technology | |
| Intel® Optane™ Memory Supported | |
| Intel® Rapid Storage technology (RST) | |
| Intel® Stable Image Platform Program (SIPP) | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Physical Address Extensions (PAE) | 36-bit |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
