Intel Celeron M 585 vs Intel Core 2 Duo SP9300
Comparative analysis of Intel Celeron M 585 and Intel Core 2 Duo SP9300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo SP9300
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 5% higher clock speed: 2.26 GHz vs 2.16 GHz
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 24% lower typical power consumption: 25 Watt vs 31 Watt
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum frequency | 2.26 GHz vs 2.16 GHz |
Maximum core temperature | 105°C vs 100°C |
Manufacturing process technology | 45 nm vs 65 nm |
L2 cache | 6 MB vs 1024 KB |
Thermal Design Power (TDP) | 25 Watt vs 31 Watt |
Compare benchmarks
CPU 1: Intel Celeron M 585
CPU 2: Intel Core 2 Duo SP9300
Name | Intel Celeron M 585 | Intel Core 2 Duo SP9300 |
---|---|---|
Geekbench 4 - Single Core | 297 | |
Geekbench 4 - Multi-Core | 568 |
Compare specifications (specs)
Intel Celeron M 585 | Intel Core 2 Duo SP9300 | |
---|---|---|
Essentials |
||
Architecture codename | Merom | Penryn |
Launch date | 20 August 2008 | 20 August 2008 |
Launch price (MSRP) | $70 | $284 |
Place in performance rating | not rated | 3205 |
Processor Number | 585 | SP9300 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 2.16 GHz | 2.26 GHz |
Bus Speed | 667 MHz FSB | 1066 MHz FSB |
Die size | 143 mm2 | 107 mm2 |
Front-side bus (FSB) | 667 MHz | 1066 MHz |
L2 cache | 1024 KB | 6 MB |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 100°C | 105°C |
Maximum frequency | 2.16 GHz | 2.26 GHz |
Number of cores | 1 | 2 |
Number of threads | 1 | 2 |
Transistor count | 291 million | 410 million |
VID voltage range | 0.95-1.30V | 1.050V - 1.150V |
Compatibility |
||
Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 22mm x 22mm |
Sockets supported | PPGA478 | BGA956 |
Thermal Design Power (TDP) | 31 Watt | 25 Watt |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) |