Intel Celeron M U3400 vs Intel Core 2 Duo T7500

Comparative analysis of Intel Celeron M U3400 and Intel Core 2 Duo T7500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Celeron M U3400

  • CPU is newer: launch date 3 year(s) 0 month(s) later
  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Launch date 24 May 2010 vs 8 May 2007
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 32 nm vs 65 nm
Thermal Design Power (TDP) 18 Watt vs 35 Watt

Reasons to consider the Intel Core 2 Duo T7500

  • Around 108% higher clock speed: 2.2 GHz vs 1.06 GHz
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 89% better performance in PassMark - Single thread mark: 863 vs 456
  • Around 60% better performance in PassMark - CPU mark: 828 vs 516
  • Around 87% better performance in Geekbench 4 - Single Core: 301 vs 161
  • Around 65% better performance in Geekbench 4 - Multi-Core: 507 vs 307
Specifications (specs)
Maximum frequency 2.2 GHz vs 1.06 GHz
L2 cache 4096 KB vs 512 KB
Benchmarks
PassMark - Single thread mark 863 vs 456
PassMark - CPU mark 828 vs 516
Geekbench 4 - Single Core 301 vs 161
Geekbench 4 - Multi-Core 507 vs 307

Compare benchmarks

CPU 1: Intel Celeron M U3400
CPU 2: Intel Core 2 Duo T7500

PassMark - Single thread mark
CPU 1
CPU 2
456
863
PassMark - CPU mark
CPU 1
CPU 2
516
828
Geekbench 4 - Single Core
CPU 1
CPU 2
161
301
Geekbench 4 - Multi-Core
CPU 1
CPU 2
307
507
Name Intel Celeron M U3400 Intel Core 2 Duo T7500
PassMark - Single thread mark 456 863
PassMark - CPU mark 516 828
Geekbench 4 - Single Core 161 301
Geekbench 4 - Multi-Core 307 507
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 0.235
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 15.316
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.072
CompuBench 1.5 Desktop - Video Composition (Frames/s) 0.264
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 1.59

Compare specifications (specs)

Intel Celeron M U3400 Intel Core 2 Duo T7500

Essentials

Architecture codename Arrandale Merom
Launch date 24 May 2010 8 May 2007
Place in performance rating 3217 3220
Processor Number U3400 T7500
Series Legacy Intel® Celeron® Processor Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Vertical segment Mobile Mobile
Launch price (MSRP) $234
Price now $42.99
Value for money (0-100) 8.72

Performance

64 bit support
Base frequency 1.06 GHz 2.20 GHz
Bus Speed 2.5 GT/s DMI 800 MHz FSB
Die size 81 mm2 143 mm2
Front-side bus (FSB) 2500 MHz 800 MHz
L2 cache 512 KB 4096 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 105°C 100°C
Maximum frequency 1.06 GHz 2.2 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 382 million 291 million
L1 cache 128 KB
VID voltage range 1.075V - 1.250V

Memory

Max memory channels 2
Maximum memory bandwidth 12.8 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800

Graphics

Graphics base frequency 166 MHz
Graphics max dynamic frequency 500 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size BGA 34mm x 28mm 35mm x 35mm
Sockets supported BGA1288 PPGA478, PBGA479
Thermal Design Power (TDP) 18 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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