Intel Celeron M U3400 vs Intel Core 2 Duo T7500
Comparative analysis of Intel Celeron M U3400 and Intel Core 2 Duo T7500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Celeron M U3400
- CPU is newer: launch date 3 year(s) 0 month(s) later
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Launch date | 24 May 2010 vs 8 May 2007 |
Maximum core temperature | 105°C vs 100°C |
Manufacturing process technology | 32 nm vs 65 nm |
Thermal Design Power (TDP) | 18 Watt vs 35 Watt |
Reasons to consider the Intel Core 2 Duo T7500
- Around 108% higher clock speed: 2.2 GHz vs 1.06 GHz
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 89% better performance in PassMark - Single thread mark: 863 vs 456
- Around 60% better performance in PassMark - CPU mark: 828 vs 516
- Around 87% better performance in Geekbench 4 - Single Core: 301 vs 161
- Around 65% better performance in Geekbench 4 - Multi-Core: 507 vs 307
Specifications (specs) | |
Maximum frequency | 2.2 GHz vs 1.06 GHz |
L2 cache | 4096 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 863 vs 456 |
PassMark - CPU mark | 828 vs 516 |
Geekbench 4 - Single Core | 301 vs 161 |
Geekbench 4 - Multi-Core | 507 vs 307 |
Compare benchmarks
CPU 1: Intel Celeron M U3400
CPU 2: Intel Core 2 Duo T7500
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Celeron M U3400 | Intel Core 2 Duo T7500 |
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PassMark - Single thread mark | 456 | 863 |
PassMark - CPU mark | 516 | 828 |
Geekbench 4 - Single Core | 161 | 301 |
Geekbench 4 - Multi-Core | 307 | 507 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.235 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 15.316 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.072 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.264 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.59 |
Compare specifications (specs)
Intel Celeron M U3400 | Intel Core 2 Duo T7500 | |
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Essentials |
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Architecture codename | Arrandale | Merom |
Launch date | 24 May 2010 | 8 May 2007 |
Place in performance rating | 3217 | 3220 |
Processor Number | U3400 | T7500 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $234 | |
Price now | $42.99 | |
Value for money (0-100) | 8.72 | |
Performance |
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64 bit support | ||
Base frequency | 1.06 GHz | 2.20 GHz |
Bus Speed | 2.5 GT/s DMI | 800 MHz FSB |
Die size | 81 mm2 | 143 mm2 |
Front-side bus (FSB) | 2500 MHz | 800 MHz |
L2 cache | 512 KB | 4096 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 105°C | 100°C |
Maximum frequency | 1.06 GHz | 2.2 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 382 million | 291 million |
L1 cache | 128 KB | |
VID voltage range | 1.075V - 1.250V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 12.8 GB/s | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3 800 | |
Graphics |
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Graphics base frequency | 166 MHz | |
Graphics max dynamic frequency | 500 MHz | |
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | BGA 34mm x 28mm | 35mm x 35mm |
Sockets supported | BGA1288 | PPGA478, PBGA479 |
Thermal Design Power (TDP) | 18 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |