Intel Celeron M U3400 processor review

Intel Celeron M U3400

Celeron M U3400 processor released by Intel; release date: 24 May 2010. The processor is designed for mobile-computers and based on Arrandale microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.06 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 32 nm. Cache size: L2 - 512 KB, L3 - 2048 KB.

Supported memory types: DDR3 800. Maximum memory size: 8 GB.

Supported socket types: BGA1288. Maximum number of processors in a configuration - 1. Power consumption (TDP): 18 Watt.

The processor has integrated graphics Intel HD Graphics.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
456
PassMark
CPU mark
Top 1 CPU
This CPU
156834
516
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
161
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
307
Name Value
PassMark - Single thread mark 456
PassMark - CPU mark 516
Geekbench 4 - Single Core 161
Geekbench 4 - Multi-Core 307

Specifications (specs)

Essentials

Architecture codename Arrandale
Launch date 24 May 2010
Place in performance rating 3217
Processor Number U3400
Series Legacy Intel® Celeron® Processor
Status Discontinued
Vertical segment Mobile

Performance

64 bit support
Base frequency 1.06 GHz
Bus Speed 2.5 GT/s DMI
Die size 81 mm2
Front-side bus (FSB) 2500 MHz
L2 cache 512 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm
Maximum core temperature 105°C
Maximum frequency 1.06 GHz
Number of cores 2
Number of threads 2
Transistor count 382 million

Memory

Max memory channels 2
Maximum memory bandwidth 12.8 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800

Graphics

Graphics base frequency 166 MHz
Graphics max dynamic frequency 500 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size BGA 34mm x 28mm
Sockets supported BGA1288
Thermal Design Power (TDP) 18 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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