Intel Celeron N4500 vs AMD R-272F
Comparative analysis of Intel Celeron N4500 and AMD R-272F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron N4500
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 32 nm
- 5.8x lower typical power consumption: 6 Watt vs 35 Watt
- Around 23% better performance in PassMark - Single thread mark: 1337 vs 1087
- Around 57% better performance in PassMark - CPU mark: 1906 vs 1215
| Specifications (specs) | |
| Maximum core temperature | 105°C vs 100 °C |
| Manufacturing process technology | 10 nm vs 32 nm |
| Thermal Design Power (TDP) | 6 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1337 vs 1087 |
| PassMark - CPU mark | 1906 vs 1215 |
Reasons to consider the AMD R-272F
- Around 14% higher clock speed: 3.2 GHz vs 2.80 GHz
| Maximum frequency | 3.2 GHz vs 2.80 GHz |
Compare benchmarks
CPU 1: Intel Celeron N4500
CPU 2: AMD R-272F
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron N4500 | AMD R-272F |
|---|---|---|
| PassMark - Single thread mark | 1337 | 1087 |
| PassMark - CPU mark | 1906 | 1215 |
Compare specifications (specs)
| Intel Celeron N4500 | AMD R-272F | |
|---|---|---|
Essentials |
||
| Architecture codename | Jasper Lake | Piledriver |
| Launch date | Q1'21 | 21 May 2012 |
| Place in performance rating | 1891 | 2183 |
| Processor Number | N4500 | |
| Series | Intel Celeron Processor N Series | |
| Status | Launched | |
| Vertical segment | Mobile | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 2.7 GHz |
| L3 cache | 4 MB | |
| Manufacturing process technology | 10 nm | 32 nm |
| Maximum core temperature | 105°C | 100 °C |
| Maximum frequency | 2.80 GHz | 3.2 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| L1 cache | 96 KB | |
| L2 cache | 1 MB | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory size | 16 GB | |
| Supported memory frequency | 2933 MHz | |
| Supported memory types | DDR4 LPDDR4x | DDR3-1600, DDR3L-1600, DDR3U-1600 |
| Maximum memory bandwidth | 25.6 GB/s | |
Graphics |
||
| Device ID | 0x4E55 | |
| Execution Units | 16 | |
| Graphics base frequency | 350 MHz | 497 MHz |
| Graphics max frequency | 750 MHz | 686 MHz |
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics | Radeon HD 7520G |
| Number of pipelines | 192 | |
| Unified Video Decoder (UVD) | ||
| Video Codec Engine (VCE) | ||
Graphics interfaces |
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| DisplayPort | ||
| eDP | ||
| HDMI | ||
| MIPI-DSI | ||
| Number of displays supported | 3 | 4 |
| DVI | ||
| VGA | ||
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2160@60Hz | |
| Max resolution over eDP | 4096x2160@60Hz | |
Graphics API support |
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| DirectX | 12 | 11 |
| OpenGL | 4.5 | 4.2 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 35mm x 24mm | |
| Scenario Design Power (SDP) | 4.8 W | |
| Sockets supported | FCBGA1338 | FS1 |
| Thermal Design Power (TDP) | 6 Watt | 35 Watt |
Peripherals |
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| Integrated LAN | ||
| Integrated Wireless | Intel Wireless-AX MAC | |
| Max number of PCIe lanes | 8 | 16 |
| Max number of SATA 6 Gb/s Ports | 2 | |
| Number of USB ports | 14 | |
| UART | ||
| USB revision | 2.0/3.2 | |
| PCI Express revision | 2.0 | |
Security & Reliability |
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| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||
| Secure Boot | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| General-Purpose Input/Output (GPIO) | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Smart Response technology | ||
| Intel® Turbo Boost technology | ||
| Speed Shift technology | ||
| Thermal Monitoring | ||
| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Fused Multiply-Add 4 (FMA4) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||